Gate signal transmission circuit structure
A gate signal transmission circuit structure is provided which is disposed on a peripheral circuit region of a display panel and includes at least a driver bonding pad, at least a transmission line and a plurality of connection lines. The transmission line is disposed around the driver bonding pad. The connection lines are connected between the driver bonding pad and the transmission line, wherein a plurality of holes exist between the connection lines, and the thickness of each connection line is substantially the same as the thickness of the transmission line.
1. A gate signal transmission circuit structure, disposed on a peripheral circuit region of a display panel and comprising:
at least a driver bonding pad;
at least a transmission line, disposed around the driver bonding pad; and
a plurality of connection lines, connected between the driver bonding pad and the transmission line, wherein a plurality of holes exist between the connection lines, and the thickness of each connection line is substantially the same as the thickness of the transmission line.
2. The gate signal transmission circuit structure as claimed in claim 1 , wherein the area of each of the connection lines is less than the area of the driver bonding pad or the area of the transmission line.
3. The gate signal transmission circuit structure as claimed in claim 1 , wherein the connection lines form a net-like connection structure.
4. The gate signal transmission circuit structure as claimed in claim 1 , wherein the transmission line comprises a first transmission portion and a second transmission portion, the first transmission portion is disposed between the connection lines and the second transmission portion, and the first transmission portion is connected to the connection lines and the second transmission portion.
5. The gate signal transmission circuit structure as claimed in claim 4 , wherein the first transmission portion comprises a net-like transmission line.
6. The gate signal transmission circuit structure as claimed in claim 1 , wherein the shape of each of the holes comprises rectangular, square, rhombus, circle or ellipse.
7. The gate signal transmission circuit structure as claimed in claim 1 , wherein the transmission line comprises a bimetal layer structure.
8. The gate signal transmission circuit structure as claimed in claim 7 , wherein material of the connection lines is the same as the material of the transmission line.
9. The gate signal transmission circuit structure as claimed in claim 1 , wherein the driver bonding pad is composed of a first metal layer, a first insulation layer, a second metal layer, a second insulation layer and a third metal layer stacked by each other sequentially, the first insulation layer has at least a first opening, the third metal layer is electrically connected to the first metal layer through the first opening, the second insulation layer has at least a second opening, and the third metal layer is electrically connected to the second metal layer through the second opening.
10. The gate signal transmission circuit structure as claimed in claim 9 , wherein the material of the third metal layer comprises indium tin oxide (ITO) or indium zinc oxide (IZO).