Photo-curable and thermo-curable resin composition, and a dry film solder resist
The present invention relates to a photo-curable and thermo-curable resin composition and a dry film solder resist making it possible to provide the dry film solder resist having superior heat-resistance and dimensional stability while exhibiting improved alkali developing properties. The resin composition may comprise an acid-modified oligomer having carboxyl group (—COOH) and photo-curable functional group; a photo-polymerizable monomer comprising a compound having a structure that three or more functional epoxy-acrylate groups are bonded to a heterocyclic structure containing nitrogen, and a functional group having carboxyl group is bonded to at least one epoxy-acrylate group; a thermo-curable binder having thermo-curable functional group; and a photo-initiator.
1. A dry film solder resist, comprising a cured product of:
an acid-modified oligomer having a carboxyl group (—COON) and a photo-curable functional group;
a photo-polymerizable monomer comprising a compound having a structure that three or more epoxy-acrylate groups are bonded to a heterocyclic structure containing nitrogen and a functional group having a carboxyl group is bonded to at least one epoxy acrylate group; and
a thermo-curable binder having a thermo-curable functional group,
wherein the dry film solder resist is formed on a circuit board having a conductive pattern in a dried and cured film form.
2. The dry film solder resist according to claim 1 , wherein the carboxyl groups of the acid-modified oligomer and the compound included in the photo-polymerizable monomer are cross-linked with the thermo-curable functional group, and the photo-curable functional group of the acid-modified oligomer is cross-linked with the epoxy acrylate group of the compound included in the photo-polymerizable monomer, in the cured product.