Image sensor module and method of manufacturing the same
An image sensor module includes a transparent substrate having recesses defined in a lower face thereof. A light concentration member includes transparent light concentration parts each of which are disposed in a corresponding one of the recesses. Color filters are disposed over each of the light concentration parts and photo diode units having photo diodes are disposed over each of the color filters. An insulation member covers the photo diode units and input/output terminals disposed over the insulation member are each electrically connected to a corresponding photo diode unit.
1. An image sensor module, comprising:
a transparent substrate having recesses defined in a lower face of the transparent substrate;
a light concentration member including transparent light concentration parts and connection parts disposed on a portion of the lower face between the transparent light concentration parts, each of the transparent light concentration parts disposed in a corresponding one of the recesses;
color filters disposed on each of the transparent light concentration parts;
photo diode units comprising:
photo diodes that are disposed on each of the color filters; and
driving units disposed between the color filters and connected with each of the photo diodes;
an insulation member covering the photo diode units;
input/output terminals disposed on the insulation member and electrically connected to a corresponding one of the photo diode units; and
contact members electrically connected on each of the input/output terminals.
2. The image sensor module according to claim 1 , wherein the transparent substrate comprises any one of a transparent glass substrate, a transparent quartz substrate, and a transparent synthetic resin substrate.
3. The image sensor module according to claim 1 , wherein a portion of the lower face of the transparent substrate defined by a recess has a curved face.
4. The image sensor module according to claim 1 , wherein each of the light concentration parts has a convex lens shape.
5. The image sensor module according to claim 1 , wherein the connection parts are integral with the transparent light concentration parts.
6. The image sensor module according to claim 5 , wherein the connection parts comprise a transparent single crystalline silicon.
7. The image sensor module according to claim 6 , wherein the driving units are formed on respective connection parts.
8. The image sensor module according to claim 1 , further comprising:
a semiconductor layer formed on portions the lower face of the transparent substrate between the transparent light concentration parts.
9. The image sensor module according to claim 8 , wherein the semiconductor layer comprises a single crystalline silicon layer.
10. The image sensor module according to claim 1 , further comprising:
a transparent planarization layer disposed between the color filters and the photo diodes facing the color filters.
11. The image sensor module according to claim 10 , further comprising:
a black matrix pattern disposed on the transparent planarization layer and between adjacent color filters in a matrix configuration.
12. The image sensor module according to claim 1 , wherein each of the photo diodes are directly disposed over the color filters.
13. The image sensor module according to claim 1 , further comprising:
one or more lenses disposed on an upper face that faces away from the lower face.
14. The image sensor module according to claim 13 , wherein at least a portion of the lower face is concave in shape and the one or more lenses are disposed within the concave portion of the lower face.
15. The image sensor module according to claim 13 , further comprising:
a holder fixing the one or more lenses to the upper face and covering a portion of the transparent substrate, wherein the holder includes an opening that exposes the one or more lenses.