IP Library Granted Patent US 8,361,830
Granted Patent B2
US 8,361,830 · App. 12/757,228 · Granted Jan 29, 2013

Image sensor module and method of manufacturing the same

Inventors: Chuan-Hui Yang (Tainan County, TW); Hsin-Chang Hsiung (Tainan County, TW); Yi-Chuan Lo (Tainan County, TW); Han-Yi Kuo (Tainan County, TW)
Assignee: Himax Semiconductor, Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,361,830
App. No.
12/757,228
Granted
Jan 29, 2013
Kind
B2
Abstract

An image sensor module having a light gathering region and a light non-gathering region includes an image sensor, a light blocking spacer, a lens layer and a fixing shell. The light blocking spacer is disposed on the image sensor and located in the light non-gathering region. The light blocking spacer has a through hole exposing a portion of the image sensor in the light gathering region. The lens layer is disposed on the light blocking spacer and covers the through hole. The lens layer includes a transparent substrate and a lens disposed on the transparent substrate and located in the light gathering region. The fixing shell located in the light non-gathering region wraps the sidewalls of the image sensor, the light blocking spacer and the lens layer continuously. The material of the fixing shell includes a thermosetting material. A method for manufacturing the image sensor module is also provided.

Claims (10)

1. A method of manufacturing an image sensor module, the image sensor module having a light gathering region and a light non-gathering region, the method comprising:

providing an image sensor, a first light blocking spacer and a lens layer, wherein the first light blocking spacer is disposed on the image sensor and is located in the light non-gathering region, the first light blocking spacer has a first through hole, the first through hole exposes a portion of the image sensor in the light gathering region, the lens layer is disposed on the first light blocking spacer and covers the first through hole, the lens layer comprises a transparent substrate and a first lens, the first lens is disposed on the transparent substrate and located in the light gathering region; and

forming a fixing shell on sidewalls of the image sensor, the first light blocking spacer and the lens layer, the fixing shell located in the light non-gathering region, a material of the fixing shell comprising a thermosetting material,

wherein the method of forming the fixing shell comprises:

coating an opaque material on the sidewalls of the image sensor, the first light blocking spacer and the lens layer to form an opaque material layer; and

coating the thermosetting material on the sidewalls of the image sensor, the first light blocking spacer and the lens layer to form a thermosetting material layer, and the thermosetting material layer overlapping with the opaque material layer.

2. The method of claim 1 , wherein when coating the thermosetting material, the thermosetting material conformally and continuously covers the sidewalls of the image sensor, the first light blocking spacer and the lens layer.

3. The method of claim 1 , further comprising:

before coating the thermosetting material, forming a protection layer on a surface of the lens layer away from the first light blocking spacer, wherein the protection layer is at least located in the light gathering region; and

after coating the thermosetting material, removing the protection layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2018
From: HIMAX SEMICONDUCTOR, INC.
To: HIMAX TECHNOLOGIES LIMITED
Reel/Frame 046222/0554 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2010
From: YANG, CHUAN-HUI; HSIUNG, HSIN-CHANG; LO, YI-CHUAN; KUO, HAN-YI
To: HIMAX SEMICONDUCTOR, INC.
Reel/Frame 024212/0067 →
Continuity (1)
Related Publication 20110248367A1 · Oct 13, 2011