Image sensor having wave guide and method for manufacturing the same

1. An image sensor having a wave guide, comprising:

a semiconductor substrate formed with a photodiode and a peripheral circuit region;

an anti-reflective layer formed on the semiconductor substrate;

an insulation layer formed on the anti-reflective layer;

a wiring layer formed on the insulation layer and connected to the semiconductor substrate, wherein the wiring layer comprises a conductive layer which is directly connected to a well formed in the semiconductor substrate;

at least one interlayer dielectric stacked on the wiring layer; and

a wave guide connected to the insulation layer by passing through the interlayer dielectric and the wiring layer, wherein the vertical edges of the wiring layer contact the wave guide, wherein the wave guide is formed by:

etching the interlayer dielectric until a portion of the wiring layer is exposed to enable plasma-charged ions produced in the course of forming the wave guide to be discharged through the wiring layer to the semiconductor substrate; and

after the portion of the wiring layer is exposed, etching the portion of the wiring layer.

2. The image sensor according to claim 1 , wherein the plasma-charged ions are discharged to the semiconductor substrate through the well.

3. The image sensor according to claim 1 , wherein the well is formed through N+/P junction when the semiconductor substrate is a P type substrate, and is formed through P+/N junction when the semiconductor substrate is an N type substrate.

4. The image sensor according to claim 1 , further comprising:

a passivation layer formed on an uppermost interlayer dielectric such that the wave guide passes through the passivation layer.

5. The image sensor according to claim 4 , further comprising:

a color filter formed on the passivation layer through which the wave guide passes; and

a microlens formed on the color filter.

6. The image sensor according to claim 1 , wherein the wiring layer is formed of tungsten (W), aluminum (Al), titanium (Ti), or silicon nitride (SiN).

7. A method for manufacturing an image sensor having a wave guide, comprising the steps of:

(a) forming an anti-reflective layer on a semiconductor substrate which is formed with a photodiode and a peripheral circuit region;

(b) forming an insulation layer on the anti-reflective layer;

(c) forming a wiring layer on the insulation layer and such that the wiring layer comprises a conductive layer which is directly connected to a well formed in the semiconductor substrate;

(d) forming at least one interlayer dielectric on the wiring layer;

(e) forming a wave guide over the photodiode and such that the wave guide is connected to the insulation layer by passing through the interlayer dielectric and the wiring layer, and such that the vertical edges of the wiring layer contact the wave guide, wherein the forming the wave guide comprises:

(e1) selectively etching the interlayer dielectric until a portion of the wiring layer is exposed to enable plasma-charged ions produced in the course of forming the wave guide to be discharged through the wiring layer to the semiconductor substrate; and

(e2) selectively etching the portion of the wiring layer exposed in the step (e1) until a portion of the insulation layer formed over the photodiode is exposed.

8. The method according to claim 7 , wherein the plasma-charged ions are discharged to the semiconductor substrate through the well.

9. The method according to claim 7 , wherein the step (d) comprises the step of:

(d1) forming a passivation layer on an uppermost interlayer dielectric.

10. The method according to claim 7 , wherein the well is formed through N+/P junction when the semiconductor substrate is a P type substrate, and is formed through P+/N junction when the semiconductor substrate is an N type substrate.

11. The method according to claim 7 , wherein, in the step (c), the wiring layer is formed using tungsten (W), aluminum (Al), titanium (Ti), or silicon nitride (SiN).

12. The method according to claim 7 , further comprising the step of:

(g) etching the portion of the insulation layer exposed in the wiring layer etching step.

13. The method according to claim 9 , further comprising the steps of:

(h) forming a color filter on the passivation layer; and

(i) forming a microlens on the color filter.

14. The image sensor according to claim 1 , wherein the etching the portion of the wiring layer comprises etching the portion of the wiring layer until a portion of the insulation layer is exposed.

15. The image sensor according to claim 14 , wherein, after the wave guide is formed, the wiring layer extends to at least one edge of the wave guide.

16. The image sensor according to claim 14 , wherein, after the wave guide is formed, the wiring layer substantially or entirely surrounds the wave guide.

17. The method according to claim 7 , wherein, after the wave guide is formed, the wiring layer substantially or entirely surrounds the wave guide.