IP Library Granted Patent US 8,371,160
Granted Patent B2
US 8,371,160 · App. 12/639,665 · Granted Feb 12, 2013

Weatherized direct-mount absolute pressure sensor

Inventors: Tom Kwa (San Jose, CA); Don L. Danielson (Palo Alto, CA)
Assignee: Meggitt (San Juan Capistrano), Inc.
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Quick Facts
Patent No.
US 8,371,160
App. No.
12/639,665
Granted
Feb 12, 2013
Kind
B2
Abstract

A piezoresistive sensor assembly is provided that has a flex circuit having at least one air flow aperture formed therein. A sensor die is coupled to an absolute support and the flex circuit. The sensor die has a diaphragm that deflects in response to air flow that flows through the air flow aperture and is incident on the diaphragm. The sensor die includes one or more gages positioned on or in the diaphragm.

Claims (60)

1. A piezoresistive sensor assembly, comprising:

a flex circuit having at least one air flow aperture formed therein;

an absolute support;

a sensor die coupled to the absolute support and the flex circuit, the sensor die having a diaphragm that deflects in response to air flow that flows through the air flow aperture and is incident on the diaphragm, the sensor die including one or more gages positioned on or in the diaphragm; and

one or more heating elements built into the sensor die wherein the one or more heating elements are used to vaporize moisture entering the sensor die.

2. The assembly of claim 1 , wherein the air flow aperture is defined by a plurality of small apertures formed in the flex circuit.

3. The assembly of claim 1 , wherein the air flow aperture is defined by a mesh that includes a plurality of apertures formed in the flex circuit.

4. The assembly of claim 3 , wherein sizes of apertures of the mesh are selected to reduce an amount of contaminant and moisture collected on the diaphragm.

5. The assembly of claim 1 , wherein the heating element is formed at a periphery of the sensor die.

6. The assembly of claim 1 , further comprising:

a non-conductive adhesive that couples the flex circuit to the sensor die.

7. The assembly of claim 1 , further comprising:

a conductive adhesive coupled to conductors at the sensor die.

8. The assembly of claim 1 , a plurality of conductors at the flex circuit and coupled to a plurality of conductors at the sensor die.

9. The assembly of claim 1 , further comprising:

a feedback circuit coupled to the piezoresistive sensor that produces an output signal indicative of a change in pressure at the diaphragm.

10. The assembly of claim 9 , further comprising:

a signal processing circuit coupled to the feedback circuit for processing an output signal and determine airflow relative to a wing of an aircraft.

11. A piezoresistive sensor assembly, comprising:

a flex circuit;

a gage support coupled to the flex circuit, the flex circuit and gage support having at least one air flow aperture formed therein;

an absolute support;

a sensor die coupled to the absolute support, the sensor die having a diaphragm that deflects in response to air flow that flows through the air flow aperture and is incident on the diaphragm, the sensor die including one or more gages positioned on or in the diaphragm; and

one or more heating elements built into the sensor die wherein the one or more heating elements are used to vaporize moisture entering the sensor die.

12. The assembly of claim 11 , wherein the air flow aperture in the gage support is defined by a plurality of small apertures formed in the gage support.

13. The assembly of claim 11 , wherein the air flow aperture in the flex circuit is defined by a plurality of small apertures formed in the flex circuit.

14. The assembly of claim 11 , wherein the air flow aperture defined by a mesh that includes a plurality of apertures formed in the flex circuit.

15. The assembly of claim 14 , wherein sizes of apertures of the mesh are selected to reduce an amount of contaminant and moisture collected on the diaphragm.

16. The assembly of claim 15 , wherein the heating element is formed at a periphery of the sensor die.

17. The assembly of claim 11 , further comprising:

one or more heating elements associated with the piezoresistive sensor.

18. The assembly of claim 11 , further comprising:

a non-conductive adhesive that couples the flex circuit to the gage support.

19. The assembly of claim 11 , further comprising:

a conductive adhesive coupled to conductors at the sensor die.

20. The assembly of claim 11 , a plurality of conductors at the flex circuit and coupled to a plurality of conductors at the sensor die.

21. The assembly of claim 11 , further comprising:

a feedback circuit coupled to the piezoresistive sensor that produces an output signal indicative of a change in pressure at the diaphragm.

22. The assembly of claim 21 , further comprising:

a signal processing circuit coupled to the feedback circuit for processing an output signal and determine airflow relative to a wing of an aircraft.

23. A method for measuring airflow on a rim face of an aircraft wing that directly faces air-flow, comprising:

coupling a piezoresistive sensor assembly to a rim face of the aircraft wing, the piezoresistive sensor including, a flex circuit having at least one air flow aperture formed therein, an absolute support, and a sensor die coupled to the absolute support, the sensor die having a diaphragm;

having air flow to pass through the aperture and be incident on the diaphragm;

permitting the diaphragm to deflect in response to the air flow incident on the diaphragm;

generating an output signal indication of the amount of deflection; and

building one or more heating elements into the sensor die wherein the one or more heating elements are used to vaporize moisture entering the sensor die.

24. The method of claim 23 , further comprising:

processing the output signal; and

in response to the processing of the output signal, determining airflow of the rim face of the aircraft wing.

25. The method of claim 23 , wherein the position of the diaphragm does not disturb air flow incident on the rim face of the aircraft wing.

26. A method for measuring airflow on a rim face of an aircraft wing that directly faces air-flow, comprising:

coupling a piezoresistive sensor assembly to a rim face of the aircraft wing, the piezoresistive sensor including, a flex circuit, a gage support coupled to the flex circuit with at least one air flow aperture formed in the flex circuit and the gage support, an absolute support, and a sensor die coupled to the absolute support, the sensor die having a diaphragm;

having air flow to pass through the aperture and be incident on the diaphragm;

permitting the diaphragm to deflect in response to the air flow incident on the diaphragm; and

generating an output signal indication of the amount of deflection; and

building one or more heating elements into the sensor die wherein the one or more heating elements are used to vaporize moisture entering the sensor die.

27. The method of claim 26 , further comprising:

processing the output signal; and

in response to the processing of the output signal, determining airflow of the rim face of the aircraft wing.

28. The method of claim 26 , wherein the position of the diaphragm does not disturb air flow incident on the rim face of the aircraft wing.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2019
From: MEGGITT (ORANGE COUNTY), INC.
To: PCB PIEZOTRONICS OF NORTH CAROLINA, INC.
Reel/Frame 050009/0115 →
MERGER Recorded Nov 2, 2013
From: MEGGITT (SAN JUAN CAPISTRANO), INC.
To: MEGGITT (ORANGE COUNTY), INC.
Reel/Frame 031533/0073 →
CHANGE OF NAME Recorded Dec 20, 2012
From: ENDEVCO CORPORATION
To: MEGGITT (SAN JUAN CAPISTRANO), INC.
Reel/Frame 029530/0604 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2010
From: KWA, TOM; DANIELSON, DON L.
To: ENDEVCO CORPORATION
Reel/Frame 023976/0077 →
Continuity (1)
Related Publication 20110138900A1 · Jun 16, 2011