Post CMP scrubbing of substrates
A cleaning method is provided for brush cleaning a surface of a substrate. The method comprises scrubbing a first surface of the substrate with a brush having a first surface geometry; and then scrubbing the first surface of the substrate with a brush having a second surface geometry, wherein the first and the second surface geometries are different. Numerous other aspects are provided.
1. A method of cleaning a substrate comprising:
scrubbing a first surface of the substrate with a brush having a first surface geometry, wherein the first surface geometry is smooth relative to a brush having a second surface geometry and adapted to dislodge particles resistant to mechanical cleaning action; and then after the first surface of the substrate is scrubbed with the brush having the first surface geometry, scrubbing the first surface of the substrate with the brush having the second surface geometry, wherein the second surface geometry is profiled and adapted to dislodge particles resistant to chemical cleaning action, and wherein the first and the second surface geometries are different; and
applying a first concentration of a first cleaning fluid to the substrate while scrubbing the substrate with the brush having the first smooth surface geometry and applying a second concentration of the first cleaning fluid to the substrate while scrubbing the substrate with the brush having the second profiled surface geometry;
wherein the first concentration of the first cleaning fluid is a higher concentration than the second concentration of the first cleaning fluid.
2. The method of claim 1 , wherein scrubbing with the brush having the smooth surface geometry comprises:
trapping a cleaning fluid between the first surface of the substrate and the brush having the smooth surface geometry.
3. The method of claim 1 wherein the profiled geometry includes nodules.
4. The method of claim 1 further comprising:
applying a second cleaning fluid to the substrate while scrubbing the substrate with the brush having the second surface geometry.
5. The method of claim 4 wherein applying the first cleaning fluid to the substrate further comprises:
spraying the cleaning fluid toward the first surface of the substrate.
6. The method of claim 4 , wherein the first and second cleaning fluids include different types of chemicals.
7. The method of claim 1 wherein the brush with the first surface geometry includes a pair of first surface geometry brushes and the brush with the second surface geometry includes a pair of second surface geometry brushes.
8. The method of claim 7 further comprising:
loading the substrate into the pair of first surface geometry brushes of a scrubbing apparatus before scrubbing the first surface of the substrate.
9. The method of claim 8 further comprising:
loading the substrate into the pair of second surface geometry brushes of the scrubbing apparatus after scrubbing the first surface of the substrate with the pair of first surface geometry brushes.
10. The method of claim 1 wherein the first surface of the substrate is scrubbed with the brush with the first surface geometry for a first time period and the first surface of the substrate is scrubbed with the brush with the second surface geometry for a second time period.
11. The method of claim 1 further comprising:
spraying the first surface of the substrate with DI water after scrubbing with the brushes.