Semiconductor device and method of manufacturing a semiconductor device
A semiconductor device can be manufactured by a method that includes forming a structure that includes a plurality of layers of semiconductor material. One or more etching processes are performed on the multi-layered semiconductor structure, and then an Ar/O 2 treatment is performed on the multi-layered semiconductor structure. The Ar/O 2 treatment includes exposure of the structure to Ar ion bombardment and O 2 molecular oxidation. The Ar/O 2 treatment can be used to create a bottle-shaped structure.
1. A method of manufacturing a semiconductor device, comprising:
forming a gate structure having a plurality of layers, the plurality of layers comprising a polysilicon layer;
etching the polysilicon layer of the gate structure; and
performing an Ar/O 2 treatment prior to an overetching of the etched gate structure to form a bottle-shaped gate structure.
2. The method of claim 1 , wherein the gate structure is a polysilicon gate.
3. The method of claim 2 , wherein the Ar/O 2 treatment includes flowing O 2 gas in a range of 0 to 200 standard cubic centimeters per minute (SCCM), and flowing Ar in a range of 0 to 1000 standard cubic centimeters per minute (SCCM).
4. The method of claim 1 , wherein the Ar/O 2 treatment includes applying source power in a range of 10 to 1000 Watts and bias power in a range of 10 to 300 Watts.
5. The method of claim 1 , wherein the gate structure comprises tungsten silicide, a first polysilicon layer, and a second polysilicon layer.
6. The method of claim 5 , wherein the Ar/O 2 treatment is performed prior to overetching of the second polysilicon layer.
7. The method of claim 5 , wherein the Ar/O 2 treatment is performed prior to overetching of the first polysilicon layer.
8. The method of claim 5 , wherein the Ar/O 2 treatment is performed prior to overetching of the tungsten silicide.
9. The method of claim 1 , wherein the gate structure is a metal gate.
10. The method of claim 9 , wherein the Ar/O 2 treatment includes flowing O 2 gas in a range of 0 to 200 standard cubic centimeters per minute (SCCM), and flowing Ar in a range of 0 to 1000 standard cubic centimeters per minute (SCCM).
11. The method of claim 9 , wherein the Ar/O 2 treatment includes applying source power in a range of 10 to 1000 Watts and bias power in a range of 10 to 300 Watts.
12. The method of claim 1 , wherein the Ar/O 2 treatment is performed ex-situ in an oxide etching chamber, and comprises flowing O 2 gas in a range of 0 to 200 standard cubic centimeters per minute (SCCM), flowing Ar in a range of 0 to 1000 standard cubic centimeters per minute (SCCM), applying source power in a range of 10 to 1000 Watts and bias power in a range of 10 to 300 Watts.