Diode for adjusting pin resistance of a semiconductor device

1. A diode comprising:

a P-type well formed in a semiconductor substrate;

a first N-type impurity doping area formed in the P-type well;

a second N-type impurity doping area formed in the P-type well;

a first P-type impurity doping area formed in the P-type well, and parallel to and apart from the first N-type impurity doping area;

a second P-type impurity doping area formed in the P-type well, and parallel to and apart from the second N-type impurity doping area;

a first isolation area formed between the first N-type impurity doping area and the first P-type impurity doping area;

a second isolation area formed between the second N-type impurity doping area and the second P-type impurity doping area;

first contacts formed in the first N-type impurity doping area and the first P-type impurity doping area in a single row or a plurality of rows; and

second contacts formed in the second P-type impurity doping area and the second N-type impurity doping area in a single row or a plurality of rows,

wherein a distance between the second N-type impurity doping area and the second P-type impurity doping area is greater than a distance between the first N-type impurity doping area and the first P-type impurity doping area, and a contact pitch between the second contacts is greater than a contact pitch between the first contacts.

2. The diode according to claim 1 , wherein the distance between the first N-type impurity doping area and the first P-type impurity doping area is determined based on a distance that is defined according to a design rule for a minimum distance between an N-type impurity doping area and a P-type impurity doping area in the diode, and the distance between the second N-type impurity doping area and the second P-type impurity doping area is determined to be at least two times greater than the distance between the first N-type impurity doping area and the first P-type impurity doping area.

3. The diode according to claim 1 , wherein the contact pitch between the first contacts is determined based on a contact pitch that is defined according to a minimum contact pitch design rule in the diode, and the contact pitch between the second contacts is determined to be at least two times greater than the contact pitch between the first contacts.

4. The diode according to claim 1 , wherein the contact pitch between the first contacts is determined based on a contact pitch that is defined according to a minimum contact pitch design rule in the diode, and contact pitch between some of the second contacts is determined to be the same as the contact pitch between the first contacts while the contact pitch between the others of the second contacts is determined to be at least two times greater than the contact pitch between the first contacts.

5. The diode according to claim 1 , wherein the first N-type impurity doping area is formed to be parallel to the second N-type impurity doping area.

6. A diode comprising:

a well of a first polarity type formed in a semiconductor substrate;

a first impurity doping area of a second polarity type formed in the well;

a second impurity doping area of the second polarity type formed in the well;

a third impurity doping area of the first polarity type formed in the well and parallel to and apart from the first impurity doping;

a fourth impurity doping area of the first polarity type formed in the well, and parallel to and apart from the second impurity doping area;

a first isolation area formed between the first impurity doping area and the third impurity doping area;

a second isolation area formed between the second impurity doping area and the fourth impurity doping area;

first contacts formed in the first impurity doping area and the third impurity doping area in a single row or a plurality of rows; and

second contacts formed in the second impurity doping area and the fourth impurity doping area in a single row or a plurality of rows,

wherein a distance between the second impurity doping area and the fourth impurity doping area is greater than a distance between the first impurity doping area and the third impurity doping area, and a contact pitch between the second contacts is greater than a contact pitch between the first contacts.

7. The diode according to claim 6 , wherein the distance between the first impurity doping area and the third impurity doping area is determined based on a distance that is defined according to a design rule for a minimum distance between an impurity doping area of the second polarity type and an impurity doping area of the first polarity type in the diode, and the distance between the second impurity doping area and the fourth impurity doping area is determined to be at least two times greater than the distance between the first impurity doping area and the third impurity doping area.

8. The diode according to claim 6 , wherein the contact pitch between the first contacts is determined based on a contact pitch that is defined according to a minimum contact pitch design rule in the diode, and the contact pitch between the second contacts is determined to be at least two times greater than the contact pitch between the first contacts.

9. The diode according to claim 6 , wherein the contact pitch between the first contacts is determined based on a contact pitch that is defined according to a minimum contact pitch design rule in the diode, and the contact pitch between some of the second contacts is determined to be the same as the contact pitch between the first contacts while the contact pitch between the others of the second contacts is determined to be at least two times greater than the contact pitch between the first contacts.

10. The diode according to claim 6 , wherein the first impurity doping area is formed to be parallel to the second impurity doping area.

11. A diode comprising:

a well of a first polarity type formed in a semiconductor substrate;

a first anode formed in the well;

a second anode formed in the well, and parallel to the first anode;

a first cathode formed to be parallel to and apart from the first anode;

a second cathode formed to be parallel to and apart from the second anode, and formed to be parallel to the first cathode; and

an isolation area formed between the first anode and the first cathode, and between the second anode and the second cathode,

wherein a distance between the second anode and the second cathode is greater than a distance between the first anode and the first cathode, a contact pitch of second anode is greater than a contact pitch of the first anode, and a contact pitch of the second cathode is greater than a contact pitch of the first cathode.

12. The diode according to claim 11 , wherein the distance between the first anode and the first cathode is determined based on a distance that is defined according to a minimum design rule in the diode, and the distance between the second anode and the second cathode is determined to be at least two times greater than the distance between the first anode and the first cathode.

13. The diode according to claim 11 , wherein the contact pitch of the first anode is determined based on a contact pitch that is defined according to a minimum contact pitch design rule in the diode, and the contact pitch of the second anode is determined to be at least two times greater than the contact pitch of the first anode.

14. The diode according to claim 11 , wherein the contact pitch of the first cathode is determined based on a contact pitch that is defined according to a minimum contact pitch design rule in the diode, and the contact pitch of the second cathode is determined to be at least two times greater than the contact pitch of the first cathode.