IP Library Granted Patent US 8,375,791
Granted Patent B2
US 8,375,791 · App. 12/834,250 · Granted Feb 19, 2013

Capacitive MEMS gyroscope and method of making the same

Inventor: Herb He Huang (Shanghai, CN)
Assignee: Shanghai Lexvu Opto Microelectronics Technology Co., Ltd.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,375,791
App. No.
12/834,250
Granted
Feb 19, 2013
Kind
B2
Abstract

A capacitive MEMS gyroscope and a method of making the same are disclosed. The capacitive MEMS gyroscope comprises a semiconductor substrate and a suspended composite wheel. The semiconductor substrate comprises: a read-out circuitry; at least one bottom electrode disposed on top of the semiconductor substrate, centered to a rotation axis and electrically connected to the read-out circuitry; at least one contact pad disposed on the top of the semiconductor substrate, electrically to the read-out circuitry; the composite wheel, partially made of dielectric film and configured in suspension above and in parallel to the semiconductor substrate and centered to the rotation axis, comprises: at least one top electrode disposed on the composite wheel, aligned vertically with one of the bottom electrode, electrically to the read-out circuitry; at least one circumferential spring centered to the rotation axis, bridging the composite wheel and the semiconductor substrate and consisting of at least one top electrode which electrically connects the top electrode to the contact pad on the semiconductor substrate. The gyroscope of the present invention formed by depositing and photolithographically patterning has miniaturized size, low tolerance scope and high sensing accuracy, as well as low fabrication costs owing to special bulk MEMS fabrication device unnecessary.

Claims (21)

1. A capacitive MEMS gyroscope, comprising a semiconductor substrate and a suspended composite wheel; wherein the semiconductor substrate centered to a rotation axis, comprises:

a read-out circuitry;

at least one bottom electrode disposed on top of the semiconductor substrate electrically connected to the read-out circuitry;

at least one contact pad disposed on the top of the semiconductor substrate, electrically to the read-out circuitry;

the composite wheel, partially made of dielectric film and configured in suspension above and in parallel to the semiconductor substrate and centered to the rotation axis, comprises:

at least one top electrode disposed on the composite wheel, aligned vertically with one of the bottom electrode, electrically to the read-out circuitry;

at least one circumferential spring arm centered to the rotation axis, physically bridging the composite wheel and the semiconductor substrate and consisting of at least one top electrode lead which electrically connects the top electrode to the contact pad on the semiconductor substrate.

2. The capacitive MEMS gyroscope according to claim 1 , wherein the semiconductor substrate further comprises a protruding circular central island from the semiconductor substrate;

the composite wheel further comprises:

an outer ring centered to the rotation axis;

an inner ring centered to the rotation axis and surrounding the protruding circular central island; and

at least two radial beams physically connecting the inner ring to the outer ring from the rotation axis.

3. The capacitive MEMS gyroscope according to claim 2 , wherein the at least one circumferential spring arm bridges the radial beams to the semiconductor substrate at the at least one contact pad.

4. The capacitive MEMS gyroscope according to claim 1 , wherein the semiconductor substrate is made from any or combination of semiconductor materials including silicon, germanium, gallium and arsenic.

5. The capacitive MEMS gyroscope according to claim 1 , wherein the at least one bottom electrode and contact pad are made from any or combination of aluminum, titanium, tantalum, copper, cobalt, nickel, platinum, tungsten, and their alloys.

6. The capacitive MEMS gyroscope according to claim 1 , wherein the at least one top electrode and top electrode lead are made from any or combination of aluminum, titanium, tantalum, copper, cobalt, nickel, platinum, tungsten, and their alloys.

7. The capacitive MEMS gyroscope according to claim 2 , wherein the inner ring, the radial beams, and the circumferential spring arm are made from any or combination of metals, including aluminum, titanium, tantalum, copper, cobalt, nickel, platinum and tungsten, and dielectric materials, including silicon oxide, nitride, oxynitride, carbon oxynitride, carbide and metal oxides.

8. The capacitive MEMS gyroscope according to claim 2 , wherein the protruding circular central island is made from any or combination of metals and semiconductors, including aluminum, titanium, tantalum, copper, cobalt, nickel, platinum and tungsten, as well as silicon, germanium, and silicon germanium, and the dielectric material from any or combination of silicon oxide, nitride, oxynitride, carbon oxynitride ,carbide and metal oxides.

9. The capacitive MEMS gyroscope according to claim 1 , wherein the composite wheel further comprises at least one vertical space limiter, configured at an outer edge of the composite wheel, having a first spacing smaller than a second vertical spacing of the rest of the suspended composite wheel with the semiconductor substrate.

10. The capacitive MEMS gyroscope according to claim 1 , wherein the read-out circuitry comprises complementary metal oxide semiconductor devices.

11. The capacitive MEMS gyroscope according to claim 1 , wherein the at least one circumferential spring arm is shaped in a zigzag configuration along a circumference centered to the rotation axis.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2019
From: SHANGHAI LEXVU OPTO MICROELECTRONICS TECHNOLOGY CO., LTD.; XI'AN YISHEN OPTOELECTRONICS TECHNOLOGY CO., LTD.
To: XI'AN YISHEN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 050464/0452 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2016
From: JIANGSU LEXVU ELECTRONICS CO., LTD.
To: XI'AN YISHEN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 037970/0307 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2011
From: JIANGSU LEXVU ELECTRONICS CO., LTD.
To: SHANGHAI LEXVU OPTO MICROELECTRONICS TECHNOLOGY CO., LTD
Reel/Frame 026139/0854 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2010
From: HUANG, HERB HE
To: JIANGSU LEXVU ELECTRONICS CO., LTD.
Reel/Frame 024669/0497 →
Continuity (2)
Provisional Application 61224969 · Jul 13, 2009
Related Publication 20110005319A1 · Jan 13, 2011