Copper powder for conductive paste and conductive paste
Copper powder is provided, which, while having fine granularity, does not loose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.07 to 10 atomic % Al inside each copper particle in the powder.
1. A copper powder for conductive paste comprising a plurality of copper particles, wherein each copper particle contains 0.07 to 10 atomic % Al and containing 0.01 to 0.3 atomic % P (phosphorus) inside each copper particle.
2. The copper powder for conductive paste according to claim 1 , wherein Al/P (atomic ratio) is 4 to 200.
3. The copper powder for conductive paste according to claim 2 , prepared by an atomizing method.
4. The copper powder for conductive paste according to claim 2 , wherein a difference between 245° C. and 600° C. in weight change ratio (Tg(%))/specific surface area (SSA) is 1 to 30%/m 2 /cm 3 .
5. A conductive paste containing copper powder for conductive paste according to claim 2 .
6. The copper powder for conductive paste according to claim 1 , wherein a difference between 245° C. and 600° C. in weight change ratio (Tg(%))/specific surface area (SSA) is 1 to 30%/m 2 /cm 3 .
7. A conductive paste containing copper powder for conductive paste according to claim 6 .
8. The copper powder for conductive paste according to claim 1 , prepared by an atomizing method.
9. A conductive paste containing copper powder for conductive paste according to claim 8 .
10. The copper powder for conductive paste according to claim 1 , wherein a difference between 245° C. and 600° C. in weight change ratio (Tg(%))/specific surface area (SSA) is 1 to 30%/m 2 /cm 3 .
11. A conductive paste containing copper powder for conductive paste according to claim 1 .