Silicon based capacitive microphone
View Patent ↗A silicon based capacitive microphone includes a first printed circuit board, a second printed circuit board far away from the first printed circuit board, a transducer electrically mounted on the first printed circuit board, a controlling chip electrically mounted on the second printed circuit board, a connecting member located between the first and second printed circuit boards.
1. A silicon based capacitive microphone, comprising:
a first printed circuit board;
a second printed circuit board opposed to the first printed circuit board;
a transducer electrically mounted on the first printed circuit board;
a controlling chip electrically mounted on the second printed circuit board;
a connecting member located between the first and second printed circuit boards, with one end electrically connected to a plurality of first conductive areas on the first printed circuit board, and the other end connected to a plurality of second conductive areas on the second printed circuit board; wherein
the connecting member includes a supporting body with through holes, and a plurality of connecting poles passing through the through holes.
2. The silicon based capacitive microphone as described in claim 1 , wherein the supporting body defines an opening, and the transducer partially resides in the opening.
3. The silicon based capacitive microphone as described in claim 1 , wherein the supporting body defines an opening, and the controlling chip partially resides in the opening.
4. The silicon based capacitive microphone as described in claim 1 , wherein the first printed circuit board defines a sound aperture, and the transducer covers the sound aperture.
5. The silicon based capacitive microphone as described in claim 4 further comprising a housing having a first aperture aligned with the sound aperture.
6. A silicon based capacitive microphone comprising:
a housing having a first aperture and a space;
a first printed circuit board received in the space;
a second printed circuit board opposed to the first printed circuit board;
a transducer mounted on the first printed circuit board;
a controlling chip mounted on the second printed circuit board;
a connecting member arranged in the space with one end connected to the first printed circuit board and the other end connected to the second printed circuit board;
wherein the connecting member includes a supporting body and a plurality of connecting poles.
7. The silicon based capacitive microphone as described in claim 6 , wherein the first printed circuit board comprises a plurality of first conductive areas and the second printed circuit board comprises a plurality of second conductive areas.
8. The silicon based capacitive microphone as described in claim 6 , wherein the supporting body further includes an opening for partially receiving the transducer and the controlling chip.