Heat dissipation device

1. A heat dissipation device comprising:

a first heat sink comprising a first bottom plate, a first top plate disposed on the first bottom plate and a first fin set fixed to a top face of the first top plate, a first cutout and a second cutout being respectively defined at a front side of the first bottom plate and the first top plate;

a second heat sink comprising a second bottom plate, a second top plate disposed on the second bottom plate and a second fin set fixed to a top face of the second top plate, a first embedded portion protruding from a rear side of the second bottom plate and embedded in the first cutout of the bottom plate of the first heat sink, a second embedded portion protruding from a rear side of the second top plate and embedded in the second cutout of the first top plate of the first heat sink; and

a heat pipe connecting the first heat sink with the second heat sink, the heat pipe comprising an evaporating section sandwiched between and attached to the first bottom plate and the first top plate, a condensing section sandwiched between the second bottom plate and the second top plate, and a connecting section interconnecting the evaporating section with the condensing section, the connecting section of the heat pipe being located between and directly contacting the first and second embedded portions of the second heat sink.

2. The heat dissipation device as claimed in claim 1 , wherein the second bottom plate comprises a planar second base, a second sidewall extending upwardly from a lateral side of the second base, a plurality of second protrusions extending upwardly from opposite front and rear ends of the second sidewall, and a plurality of second cuts defined at an opposite lateral side of the second base opposite to the second sidewall, the first embedded portion protruding from the second base and coplanar with the second base.

3. The heat dissipation device as claimed in claim 2 , wherein the second top plate comprises a third base, a third sidewall extending downwardly from a lateral side of the third base opposite to the second sidewall of the second bottom plate, the second embedded portion protruding from the third base and coplanar with the third base, a plurality of third protrusions extending downwardly from the third sidewall, a plurality of third cuts defined at an opposite lateral side of the third base opposite to the third sidewall, and the second and third protrusions being substantially retained into the second and third cuts, respectively.

4. The heat dissipation device as claimed in claim 1 , wherein the first cutout has a width decreasing towards the second heat sink, and the first embedded portion has a configuration complementing that of the first cutout of the first heat sink so as to be embedded in and lockable with the first cutout.

5. The heat dissipation device as claimed in claim 1 , wherein the second cutout has a width decreasing towards the second heat sink, and the second embedded portion has a configuration complementing that of the second cutout of the first heat sink so as to be embedded in and lockable with the second cutout.

6. The heat dissipation device as claimed in claim 1 , wherein the first bottom plate comprises a planar first base, a pair of first sidewalls extending upwardly from two opposite lateral sides of the first base to the first top wall, and a plurality of first protrusions extending upwardly from each first sidewall, the first cutout being defined in the first base.

7. The heat dissipation device as claimed in claim 6 , wherein a plurality of first cuts are defined at two lateral sides of the first top plate corresponding to the first protrusions of the first bottom plate, and the first protrusions are substantially retained into the first cuts, respectively.