Semiconductor capacitor
A one time programmable memory cell having a gate, a gate dielectric layer, a source region, a drain region, a capacitor dielectric layer and a conductive plug is provided herein. The gate dielectric layer is disposed on a substrate. The gate is disposed on the gate dielectric layer. The source region and the drain region are disposed in the substrate at the sides of the gate, respectively. The capacitor dielectric layer is disposed on the source region. The capacitor dielectric layer is a resistive protection oxide layer or a self-aligned salicide block layer. The conductive plug is disposed on the capacitor dielectric layer. The conductive plug is served as a first electrode of a capacitor and the source region is served as a second electrode of the capacitor. The one time programmable memory (OTP) cell is programmed by making the capacitor dielectric layer breakdown.
1. A semiconductor capacitor, comprising:
a capacitor dielectric layer which is a resistive protection oxide layer or a self-aligned silicide block layer; and
a first electrode and a second electrode disposed at opposing sides of the capacitor dielectric layer,
wherein the semiconductor capacitor is disposed on a substrate;
the second electrode is a doped region disposed in the substrate;
the capacitor dielectric layer is disposed on the doped region, and exposes a portion of the doped region; and
the first electrode is disposed on the capacitor dielectric layer.
2. The semiconductor capacitor according to claim 1 , further comprising a metal silicide layer disposed on the doped region which is exposed on the capacitor dielectric layer; and
a second conductive plug electrically connected to the metal silicide layer.
3. The semiconductor capacitor according to claim 1 , wherein the first electrode is formed from one or more first conductive plugs and the shape of the first conductive plug comprises square, rectangle, round or other shapes.
4. The semiconductor capacitor according to claim 1 , wherein the substrate comprises a silicon substrate or a silicon on insulator substrate; and
the doped region is disposed in a silicon layer of the silicon on insulator substrate.
5. The semiconductor capacitor according to claim 1 , wherein the first electrode is a conductive plug.
6. The semiconductor capacitor according to claim 1 , further comprising an etch stop layer disposed on the capacitor dielectric layer, wherein the first electrode extends through the etch stop layer and contacts with the capacitor dielectric layer.
7. A semiconductor capacitor, comprising:
a capacitor dielectric layer which is a resistive protection oxide layer or a self-aligned silicide block layer; and
a first electrode and a second electrode disposed at opposing sides of the capacitor dielectric layer,
wherein the semiconductor capacitor is disposed on an isolation structure of a substrate;
the second electrode is a doped polysilicon layer disposed on the substrate;
the capacitor dielectric layer is disposed on the doped polysilicon layer and exposes a portion of the doped polysilicon layer; and
the first electrode is disposed on the capacitor dielectric layer.
8. The semiconductor capacitor according to the claim 7 , further comprising a metal silicide layer disposed on the doped polysilicon layer which is exposed on the capacitor dielectric layer; and
a second conductive plug electrically connected to the metal silicide layer.
9. The semiconductor capacitor according to claim 7 , wherein the first electrode is a conductive plug.
10. The semiconductor capacitor according to claim 7 , further comprising an etch stop layer disposed on the capacitor dielectric layer, wherein the first electrode extends through the etch stop layer and contacts with the capacitor dielectric layer.
11. A semiconductor capacitor, comprising:
a capacitor dielectric layer which is a resistive protection oxide layer or a self-aligned silicide block layer; and
a first electrode and a second electrode disposed at opposing sides of the capacitor dielectric layer,
wherein the semiconductor capacitor is disposed on an insulating substrate;
the second electrode is a doped semiconductor layer disposed on the insulating substrate;
the capacitor dielectric layer is disposed on the doped semiconductor layer, and exposes a portion of the doped semiconductor layer; and
the first electrode is disposed on the capacitor dielectric layer.
12. The semiconductor capacitor according to the claim 11 , wherein the insulating substrate is a glass substrate.
13. The semiconductor capacitor according to claim 11 , wherein the first electrode is a conductive plug.
14. The semiconductor capacitor according to claim 11 , further comprising an etch stop layer disposed on the capacitor dielectric layer, wherein the first electrode extends through the etch stop layer and contacts with the capacitor dielectric layer.