Semiconductor integrated circuit device and fabrication process thereof

1. A semiconductor integrated circuit device having a buried interconnection in interconnection layers over a main surface of a semiconductor substrate, wherein electrical connection of interconnections are provided over and under an interconnection layer of a predetermined buried interconnection, among said interconnection layers, such that a first connecting conductor portion disposed in a connecting hole extending from an upper interconnection toward said interconnection layer of a predetermined buried interconnection and a second connecting conductor portion disposed in a connecting hole extending from a lower interconnection toward said interconnection layer of a predetermined buried interconnection are electrically connected in the vertical direction via a connecting conductor portion for relay disposed in a connecting groove of said interconnection layer of a predetermined buried interconnection in which electrical connections of said connecting conductor portion for relay with another conductive part is limited to an electrical connection at an upper surface thereof with said first connecting conductor portion and an electrical connection at a lower surface thereof with said second connecting conductive portion, said connecting conductor portion for relay is sized with an alignment margin so that, with respect to a plan view of said main surface of the substrate, the length of said connecting conductor portion for relay, measured in an extending direction of the predetermined buried interconnection, is larger than the width of said connecting conductor portion for relay, measured in a direction perpendicular to the extending direction, and is, at most, twice the width of said connecting conductor portion for relay in the direction perpendicular to the extending direction.

2. A semiconductor integrated circuit device comprising multi-level conductive layers and at least one buried interconnection in interconnection layers which are disposed over a main surface of a semiconductor substrate, wherein electrical connection of interconnections are provided over and under an interconnection layer of a predetermined buried interconnection, among said interconnection layers, such that a first connecting conductor portion disposed in a connecting hole extending from an upper interconnection toward said interconnection layer of a predetermined buried interconnection and a second connecting conductor portion disposed in a connecting hole extending from a lower interconnection toward said interconnection layer of a predetermined buried interconnection are electrically connected in the vertical direction via a connecting conductor portion for relay disposed in a connecting groove of said interconnection layer of a predetermined buried interconnection in which electrical connections of said connecting conductor portion for relay with another conductive part is limited to an electrical connection at an upper surface thereof with said first connecting conductor portion and an electrical connection at a lower surface thereof with said second connecting conductor portion, said connecting conductor portion for relay is sized with an alignment margin so that, with respect to a plan view of said main surface of the substrate, the length of said connecting conductor portion for relay, measured in an extending direction of the predetermined buried interconnection, is larger than the width of said connecting conductor portion for relay, measured in a direction perpendicular to the extending direction, and is, at most, twice the width of said connecting conductor portion for relay in the direction perpendicular to the extending direction.

3. A semiconductor integrated circuit device having a buried interconnection in interconnection layers over a semiconductor substrate, wherein electrical connection of interconnections are provided over and under an interconnection layer of a predetermined buried interconnection, among said interconnection layers, such that a first connecting conductor portion disposed in a connecting hole extending from an upper interconnection toward said interconnection layer of a predetermined buried interconnection and a second connecting conductor portion disposed in a connecting hole extending from a lower interconnection toward said interconnection layer of a predetermined buried interconnection are electrically connected in the vertical direction via a connecting conductor portion for relay disposed in a connecting groove of said interconnection layer of a predetermined buried interconnection in which electrical connections of said connecting conductor portion for relay consist of a single electrical contact at an upper surface thereof with said first connecting conductor portion and a single electrical contact at a lower surface thereof with said second connecting conductor portion, said connecting conductor portion for relay is sized with an alignment margin so that, with respect to a plan view of said main surface of the substrate, the length of said connecting conductor portion for relay, measured in an extending direction of the predetermined buried interconnection, is larger than the width of said connecting conductor portion for relay, measured in a direction perpendicular to the extending direction, and is, at most, twice the width of said connecting conductor portion for relay in the direction perpendicular to the extending direction.

4. A semiconductor integrated circuit device having a buried interconnection in interconnection layers over a main surface of a semiconductor substrate, wherein electrical connection of interconnections are provided over and under an interconnection layer of a predetermined buried interconnection, among said interconnection layers, such that a connecting conductor portion disposed in a connecting hole extending from an upper interconnection toward said interconnection layer of a predetermined buried interconnection is electrically connected in the vertical direction to a lower interconnection via a connecting conductor portion for relay disposed in a connecting groove of said interconnection layer of a predetermined buried interconnection, in which electrical connections of said connecting conductor portion for relay with another conductive part is limited to an electrical connection at an upper surface thereof with said connecting conductor portion and an electrical connection via a lower surface thereof with said lower interconnection, said connecting conductor portion for relay is sized at the upper surface thereof so that, with respect to a plan view of said main surface of the substrate, the length of said connecting conductor portion for relay, measured in an extending direction of the predetermined buried interconnection, is larger than the width of said connecting conductor portion for relay, measured in a direction perpendicular to the extending direction, and is, at most, twice the width of said connecting conductor portion for relay in the direction perpendicular to the extending direction.

5. A semiconductor integrated circuit device according to claim 4 ,

wherein said connecting conductor portion for relay includes a top portion having said upper surface and a relatively narrow, bottom portion having said lower surface, said bottom portion extending vertically from an underside of said top portion to form an electrical contact with said lower interconnection.

6. A semiconductor integrated circuit device according to claim 4 ,

wherein the electrical connection of said connecting conductor portion for relay with said lower interconnection is formed through another connecting conductor portion extended between said lower interconnection and an underside of said connecting conductor portion for relay.