Method of fabricating wiring board
A method of fabricating a wiring board including at least one conductor layer and at least one resin insulating layer, the method including a wiring groove forming step of forming a wiring groove in the resin insulating layer by irradiating a surface of the resin insulating layer with a laser, and a wiring layer forming step of forming the conductor layer such that at least a portion of the conductor layer is embedded in the wiring groove to form a wiring layer in the wiring groove.
1. A method of fabricating a wiring board including at least one conductor layer and at least one resin insulating layer, the method comprising:
a through hole forming step of forming a through hole in said resin insulating layer by irradiating said resin insulating layer with one of a carbon dioxide gas laser and a UV laser;
a wiring groove forming step of forming, after the through hole forming step, a wiring groove in said resin insulating layer by irradiating a surface of said resin insulating layer with a laser, wherein irradiating the surface of said resin insulating layer with the laser removes a residue of said resin insulating layer which remains at a bottom of said through hole;
a via conductor forming step of forming a via conductor in said through hole; and
a wiring layer forming step of forming said conductor layer such that at least a portion of said conductor layer is embedded in said wiring groove to form a wiring layer in said wiring groove.
2. The method as claimed in claim 1 , wherein in said wiring groove forming step, said surface of said resin insulating layer is irradiated with the laser through a mask formed with an opening which is configured to correspond to a shape of said wiring groove to be formed.
3. The method as claimed in claim 1 , wherein said laser is an excimer laser.
4. The method as claimed in claim 1 , wherein in said wiring groove forming step, said wiring groove is formed so as not to penetrate said resin insulating layer.
5. The method as claimed in claim 1 , wherein said wiring layer forming step and said via conductor forming step are carried out at one time after completion of said wiring groove forming step.
6. The method as claimed in claim 1 , wherein in said wiring groove forming step, a via land groove is formed recessed in said surface of said resin insulating layer to communicate with said through hole, and said via land groove and said wiring groove are formed at one time by irradiating said surface of said resin insulating layer with said laser, and in said via conductor forming step, a via land extending from said via conductor is formed.
7. The method as claimed in claim 6 , wherein in said wiring groove forming step, said via land groove is formed so as not to penetrate said resin insulating layer.