Multilayered surrounding plate type heat dissipating structure
A multilayer surrounding plate type heat dissipating structure comprises: a heat dissipating base module; a heat conducting insert, with an end coupled to the heat dissipating base module, and another end having a distal head portion; at least one light emitting element, installed at the distal head portion of the heat conducting insert; and a multilayer surrounding plate, installed to a ceiling, and having a through hole formed thereon, for passing the heat conducting insert, such that a heat source produced by the light emitting element can be dissipated through the multilayer surrounding plate or an airflow passage between multilayer surrounding plate to achieve an excellent heat dissipating effect, assure the functions of the light emitting element, and extend their lifespan.
1. A multilayer surrounding plate type heat dissipating structure, comprising:
a heat dissipating base module;
a heat conducting insert, with an end coupled to the heat dissipating base module, and another end of the heat conducting column having a distal head portion;
at least one light emitting element, installed at the distal head portion of the heat conducting insert; and
a multilayer surrounding plate, having a through hole for passing the heat conducting insert, and the multilayer surrounding plate being installed at a ceiling,
wherein the heat dissipating base module includes a base for dissipating heat from the light emitting element, and
wherein the base includes at least one lateral heat dissipation vent and distal heat dissipation vent, and the lateral heat dissipation vent includes a plurality of heat dissipating fins.
2. The multilayer surrounding plate type heat dissipating structure of claim 1 , wherein the multilayer surrounding plate is a multilayer air outlet/inlet frame that conditions the air.
3. The multilayer surrounding plate type heat dissipating structure of claim 1 , wherein the base further includes a fan corresponding to the distal heat dissipation vent.
4. The multilayer surrounding plate type heat dissipating structure of claim 3 , wherein the base includes a filter element coupled thereon.
5. The multilayer surrounding plate type heat dissipating structure of claim 1 , wherein the base and the heat conducting insert are made of a metal, ceramic or highly heat conducting composite material.
6. The multilayer surrounding plate type heat dissipating structure of claim 1 , wherein the light emitting element is a light emitting diode electrically coupled to the heat dissipating base module.
7. The multilayer surrounding plate type heat dissipating structure of claim 1 , wherein the multilayer surrounding plate includes a base plate portion with the through hole, a plurality of enclosing plates coupled around the periphery of the base plate portion, and an air gap formed separately between the base plate portion and the enclosing plate, and between the enclosing plate and the enclosing plate.
8. The multilayer surrounding plate type heat dissipating structure of claim 7 , wherein the enclosing plate has an oblique surface portion coated with a reflecting layer.