Machining device and method for machining material
The invention relates to a machining device ( 10 ) comprising at least one machining head ( 16 ) designed to provide at least one high-energy machining beam ( 22 ), especially an electron or laser beam. Such a machining device is used to remove material from workpieces ( 28 ) or for connecting workpieces ( 28 ) by bonding, especially by means of welding. According to the invention, at least one scanning device ( 32 ) designed as an optical coherence tomograph and provided for surface scanning is associated with the machining head ( 16 ). The invention also relates to a method for machining material using a high-energy machining beam for scanning surface areas of a workpiece which is machined, not yet machined, or being machined, by means of an optical coherence tomograph.
1. A machining device comprising:
at least one machining head which is configured to produce a high-energy machining beam,
an optical coherence tomograph which is configured to produce a measuring beam and to measure a distance between the machining head and a workpiece to be machined by the machining device,
a scanning device which
is configured to direct the measuring beam on various locations on the workpiece,
comprises a movably suspended mirror which is capable of being driven by a control device and
comprises an f-theta objective which is arranged in a beam path between the mirror and the workpiece.
2. The machining device of claim 1 , wherein the scanning device is integrated into the machining head in such a manner that at least one optical component is capable of being used jointly by the machining beam and by the measuring beam.
3. The machining device of claim 1 , wherein a focal plane of the machining beam and a scanning plane of the measuring beam at least substantially coincide.
4. The machining device of claim 1 , wherein the optical coherence tomography comprises an optical reference path having a length which is chosen such that a spacing between the machining head and the workpiece is greater than 100 mm.
5. The machining device of claim 4 , wherein the spacing is greater than 500 mm.
6. The machining device of claim 5 , wherein the spacing is greater than 800 mm.