IP Library › Granted Patent US 8,415,007
Granted Patent B2
US 8,415,007 · App. 13/323,375 · Granted Apr 9, 2013

Layered product

Inventors: Masato Honma (Matsuyama, JP); Souichi Ishibashi (Paris, FR); Yoshiki Takebe (Ehime, JP); Haruo Obara (Ehime, JP); Takeshi Nishizawa (Kyoto, JP); Kosuke Shiho (Otsu, JP); Seiichiro Eto (Otsu, JP); Takashi Hasegawa (Otsu, JP); Hideaki Tanisugi (Shiga, JP)
Assignee: Toray Industries, Inc.
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Quick Facts
Patent No.
US 8,415,007
App. No.
13/323,375
Granted
Apr 9, 2013
Kind
B2
Abstract

A layered product which is a molded object including a thermoset resin layer, a thermoplastic resin layer, and reinforcing fibers comprising many continuous filaments, wherein the thermoset resin layer has been united with the thermoplastic resin layer at the interface between these layers, the resin of the thermoset resin layer and the resin of the thermoplastic resin layer each having an irregular surface shape at the interface, and a group of filaments among the reinforcing fibers are in contact with at least the resin of the thermoset resin layer and the other group of filaments among the reinforcing fibers are in contact with at least the resin of the thermoplastic resin layer, and that side of the thermoplastic resin layer which is opposite to the interface being a surface of the molded object.

Claims (5)

1. A layered product comprising a prepreg obtained by impregnating unidirectional carbon fiber bundles used as reinforcing fibers with a thermosetting resin; and a base material for thermal bonding which is arranged in a region of a surface of said prepreg to be thermally bonded, and wherein said base material for thermal bonding comprises a polyamide resin selected from the group consisting of polyamide 11, polyamide 12, polyamide 610, polyamide 612, polyamide 66/6, polyamide 6/66/610, polyamide 6/66/612, polyamide 6/66/610/612, and polyamide 6/6I as a thermoplastic resin, wherein the bonding strength (S) of a test piece including the base material for thermal bonding, based on the Testing Method of Strength Properties of Adhesives in Shear by Tension Loading according to ISO 4587 is 5.0 MPa or higher at a temperature of 100 C and 1.0 MPa or lower at a temperature of 200 C.

2. The layered product according to claim 1 , wherein, where said bonding strength (S) at a temperature t (° C.) is S t (MPa) and said bonding strength (S) at a temperature (t+30) (° C.) is S (t+30) (MPa), the relation of S t ≧3×S (t+30) is satisfied when the temperature t is in the range of from 100° C. to 200° C.

3. The layered product according to claim 1 , wherein said base material is composed of a copolyamide-based resin composition.

4. The layered product according to claim 3 , wherein said copolyamide contains ternary copolyamide 6/66/610 as a component.

5. The layered product according to claim 1 , wherein said base material is in a form of a nonwoven fabric or film having a unit weight of 1 to 100 g/m 2 .

Priority Claims (3)
JP 2002-379832 · Dec 27, 2002 · national
JP 2003-043920 · Feb 21, 2003 · national
JP 2003-121379 · Apr 25, 2003 · national
Continuity (2)
Continuation 10540624
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