Electric component and component and method for the production thereof
A method for producing an electrical component ( 1 ) is proposed, in which a ceramic base body ( 5 ) that contains a through-hole contact ( 10 ) and at least one metallization surface ( 20 C) electroconductively connected to the through-hole contact is provided in a method step A). On the surface of the base body, an electrically insulating first material is arranged in layer form at least above the through-hole contact in method step B), and thereafter an electrically conductive second material is applied above through-hole contact ( 10 ) in method step C). Then a solder contact ( 30 B) that electroconductively connects through-hole contact ( 10 ) through passivation layer ( 25 B), which is formed from the first material by sintering, is formed by hardening in method step D).
1. A method of manufacturing an electrical component, comprising:
providing a base body comprised of ceramic, the base body comprising:
at least one through-hole contact that reaches a surface of the base body; and
at least one metallization surface electrically connected to the at least one through-hole contact;
applying a layer of a first material that is electrically insulating above the at least one through-hole contact;
applying a second material that is electrically conductive above the at least one through-hole contact; and
hardening the second material to form a solder contact that electrically connects to the at least one through-hole contact;
wherein providing the base body comprises:
preparing a green ceramic structure with a through-hole containing electrically conductive filling;
wherein the green ceramic structure has a greater shrinkage than the electrically conductive filling during hardening the second material; and
wherein the green ceramic structure and the electrically conductive filling are hardened to produce the base body with the at least one through-hole contact, the at least one through-hole contact projecting above the base body.
2. The method of claim 1 , wherein the at least one through-hole contact projects above the base body.
3. A method of manufacturing an electrical component, comprising:
providing a base body comprised of ceramic, the base body comprising:
at least one through-hole contact that reaches a surface of the base body and that projects above the base body; and
at least one metallization surface electrically connected to the at least one through-hole contact;
applying a layer of a first material that is electrically insulating above the at least one through-hole contact;
applying a second material that is electrically conductive above the at least one through-hole contact; and
hardening the second material to form a solder contact that electrically connects to the at least one through-hole contact;
wherein providing the base body comprises:
providing a green ceramic structure comprising
a pattern on a surface of the ceramic green ceramic structure; and
a through-hole through the pattern, an electrically conductive filling being in the through-hole and at a higher level than the surface of the green ceramic structure;
wherein the green ceramic structure and the electrically conductive filling are hardened to produce the base body with the at least one through-hole contact, the at least one through-hole contact projecting above the base body.
4. The method of claim 1 or 3 , further comprising:
hardening the first material to form a passivation layer, the first material being hardened as the second material is hardened;
wherein at least some of the first material and the second material mix together; and
wherein the solder contact contacts the at least one through-hole contact through the passivation layer.
5. The method of claim 1 or 3 , further comprising:
hardening the first material to form a passivation layer, the first material being hardened as the first material is applied;
wherein the second material mixes with the passivation layer as the second material is hardened.
6. The method of claim 1 or 3 , wherein, prior to hardening, the first material and the second material comprises free-flowing, hardenable constituents.
7. The method of claim 1 or 3 , wherein providing the base body comprises:
stacking ceramic layers.
8. A method of manufacturing an electrical component, comprising:
providing a base body comprised of ceramic, the base body comprising:
at least one through-hole contact that reaches a surface of the base body; and
at least one metallization surface electrically connected to the at least one through-hole contact;
applying a layer of a first material that is electrically insulating above the at least one through-hole contact;
applying a second material that is electrically conductive above the at least one through-hole contact; and
hardening the second material to form a solder contact that electrically connects to the at least one through-hole contact;
wherein the first material comprises glasses and the second material comprises a metal paste comprising glass constituents.
9. The method of claim 1 , 3 or 8 , wherein the first material and the second material are hardened by burning-in at roughly 600-900° C.
10. The method of claim 8 , wherein the glasses comprise one or more of aluminosilicate glasses, borate glasses, borosilicate glasses, silicate glasses, zinc borate classes, and phosphate glasses.
11. The method of claim 1 or 3 , wherein the first material comprises an organic polymer and the second material comprises a conductive adhesive comprising a polymer matrix.
12. The method of claim 11 , wherein the first material and the second material are hardened in by burning-in at roughly 150-250° C.
13. A method of manufacturing an electrical component, comprising:
providing a base body comprised of ceramic, the base body comprising:
at least one through-hole contact that reaches a surface of the base body; and
at least one metallization surface electrically connected to the at least one through-hole contact;
applying a layer of a first material that is electrically insulating above the at least one through-hole contact;
applying a second material that is electrically conductive above the at least one through-hole contact; and
hardening the second material to form a solder contact that electrically connects to the at least one through-hole contact;
wherein the electrical component comprises a varistor; and
wherein the ceramic comprises ZnO—Bi or ZnO—Pr.
14. The method of claim 1 or 3 , wherein the electrical component comprises a capacitor; and
wherein the ceramic comprises a material from one of temperature classes COG, X7R, Z5U, Y5V and HQM.
15. The method of claim 1 or 3 , wherein the ceramic comprises a ferrite ceramic.
16. The method of claim 1 , 3 , 9 or 13 , further comprising:
forming at least one intermediate metal layer on the solder contact.
17. The method of claim 16 , wherein the at least one intermediate metal layer comprises at least one of Ni, Pd, Cu, Cr, Ag and Au.
18. The method of claim 1 , 3 , 8 or 13 , further comprising:
applying a solder ball above the solder contact.
19. The method of claim 18 , wherein the solder ball comprises at least one of Sn, SnPb, SnAgCu, SnAgCuBi, SnZn, and SnAg.
20. The method of claim 1 , 3 , 8 or 13 , wherein the at least one through-hole contact comprises at least one of Ag, Pd, Pt, AgPd, AgPt, AgPdPt, Ni, and Cu.
21. The method of claim 1 , 3 , 8 or 13 , wherein the ceramic comprises an HTCC or an LTCC material.