IP Library Granted Patent US 8,416,473
Granted Patent B2
US 8,416,473 · App. 13/548,270 · Granted Apr 9, 2013

Solid-state imaging device

Inventors: Tomoya Yoneda (Chiba-ken, JP); Shigetoshi Sugawa (Atsugi, JP); Toru Koizumi (Yokohama, JP); Tetsunobu Kochi (Hiratsuka, JP)
Assignee: Canon Kabushiki Kaisha
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Quick Facts
Patent No.
US 8,416,473
App. No.
13/548,270
Granted
Apr 9, 2013
Kind
B2
Abstract

To control the potential distribution generated in a well at the time of amplification and reduce a shading in a solid-state imaging device of amplification type, the amplification type solid-state imaging device of the present invention comprises a plurality of picture elements each including photoelectric conversion elements formed in a second conductivity type common well inside a first conductivity type substrate, wherein a plurality of well contacts are disposed inside a picture element array area.

Claims (24)

1. A solid-state imaging device comprising:

a pixel region in which a plurality of pixels are arranged, each of the pixels including a photoelectric conversion element;

a plurality of amplifying transistors of a first conductivity type arranged in the pixel region, each of the amplifying transistors being arranged correspondingly to one of the pixels, wherein each amplifying transistor includes a gate that receives a charge generated in one of the photoelectric conversion elements;

a common well of a second conductivity type in which source and drain regions of the plurality of amplifying transistors are arranged;

a plurality of semiconductor regions of the second conductivity type arranged in the common well of the second conductivity type within the pixel region; and

a plurality of well contacts arranged in the pixel region, wherein the well contacts are electrically contacted, and supply a reference voltage to the common well, and wherein each of the well contacts is shared by more than one of the pixels.

2. The solid-state imaging device according to claim 1 , wherein each of the pixels has a transfer transistor for transferring the charge from the photoelectric conversion element to a floating diffusion region, and a reset transistor for supplying a reset voltage to the floating diffusion region.

3. The solid-state imaging device according to claim 1 , further comprising

a color filter arranged above the photoelectric conversion element of one of the pixels.

4. The solid-state imaging device according to claim 1 , further comprising

a well wiring connected to at least one of the well contacts and arranged at a predetermined interval in a row direction or a column direction of the pixels.

5. The solid-state imaging device according to claim 1 , wherein the well contacts are further arranged at a periphery of the pixel region of the common well.

6. A solid-state imaging device comprising:

a pixel region in which a plurality of pixels are arranged, each of the pixels including a photoelectric conversion element;

a plurality of amplifying transistors of a first conductivity type arranged in the pixel region, each of the amplifying transistors being arranged correspondingly to one of the pixels, wherein each amplifying transistor includes a gate that receives a charge generated in one of the photoelectric conversion elements;

a common well of a second conductivity type in which source and drain regions of the plurality of amplifying transistors are arranged; and

a plurality of well contacts supplying a reference voltage to the common well,

wherein the plurality of well contacts include well contacts arranged within the pixel region and well contacts arranged at a periphery of the pixel region.

7. The solid-state imaging device according to claim 6 , wherein each of the pixels has a transfer transistor for transferring the charge from the photoelectric conversion element to a floating diffusion region, and a reset transistor for supplying a reset voltage to the floating diffusion region.

8. The solid-state imaging device according to claim 6 , further comprising:

a color filter arranged above the photoelectric conversion element of one of the pixels.

9. The solid-state imaging device according to claim 6 , further comprising:

a well wiring connected to at least one of the well contacts, and arranged at a predetermined interval in a row direction or a column direction of the pixels.

10. The solid-state imaging device according to claim 6 , wherein each of the well contacts is connected to a plurality of semiconductor regions of the second conductivity type arranged in the common well.

Priority Claims (2)
JP 11-346255 · Dec 6, 1999 · national
JP 2000-365552 · Nov 30, 2000 · national
Continuity (6)
Division 13045775 · Mar 11, 2011
Division 12958817 · Dec 2, 2010
Division 12264972 · Nov 5, 2008
Division 11104538 · Apr 13, 2005
Division 09727486 · Dec 4, 2000
Related Publication 20120281262A1 · Nov 8, 2012