Method of manufacturing light-emitting device
View Patent ↗A method of manufacturing a light-emitting device includes forming a planar board that includes a plurality of first metallic plates and a plurality of second metallic plates continuously connected by a resin, by use of a positioning frame including a plurality of first concave portions and a plurality of second concave portions, mounting a plurality of light-emitting diode elements on the planar board, and sealing the light-emitting diode elements collectively, thereby producing a plurality of light-emitting devices.
1. A method of manufacturing a light-emitting device comprising:
positioning at least one first metallic plate in at least one first concave portion of a positioning frame and at least one second metallic plate in at least one second concave portion of the positioning frame;
adhering a surface of an adhesive sheet to the first metallic plate in the first concave portion of the positioning frame and the second metallic plate in the second concave portion of the positioning frame;
removing the first metallic plate and the second metallic plate that are adhered to the adhesive sheet, from the first concave portion and the second concave portion of the positioning frame;
filling a resin in spaces except the first metallic plate and the second metallic plate on the surface of the adhesive sheet to form a planar board including the first metallic plate and the second metallic plate connected by the resin;
removing the adhesive sheet from the planar board;
mounting at least one light-emitting diode element that includes a pair of a first element electrode and a second element electrode, on the first metallic plate;
electrically connecting one of the first and second element electrodes of the light-emitting diode element, to the second metallic plate by at least one wire; and
forming a sealing resin on a side of the planar board, the side being a side where the light-emitting diode element is mounted on the first metallic plate.
2. The method of manufacturing a light-emitting device according to claim 1 comprising:
positioning a plurality of pairs of the first metallic plate and the second metallic plate in a plurality of pairs of the first concave portion and the second concave portion of a positioning frame;
adhering a surface of an adhesive sheet to the plurality of pairs of the first metallic plate and the second metallic plate;
removing the plurality of pairs of the first metallic plate and the second metallic plate that are adhered to the adhesive sheet, from the plurality of pairs of the first concave portion and the second concave portion of the positioning frame;
filling a resin in spaces except the plurality of pairs of the first metallic plate and the second metallic plate on the surface of the adhesive sheet to form a planar board including the plurality of pairs of the first metallic plate and the second metallic plate connected by the resin;
removing the adhesive sheet from the planar board;
mounting a plurality of light-emitting diode elements each including the first and second element electrodes, on the first metallic plates of the plurality of pairs;
electrically connecting the second element electrodes of the light-emitting diode elements, to the second metallic plates by wires;
forming a sealing resin on a side of the planar board, the side being a side where the plurality of light-emitting diode elements are mounted on the first metallic plates; and
dividing the sealing resin on the planar board into a plurality of light-emitting diode devices.
3. The method of manufacturing a light-emitting device according to claim 1 comprising:
when electrically connecting one of the first and second element electrodes of the light-emitting diode element to the second metallic plate by at least one wire, electrically connecting another of the first and second element electrodes of the light-emitting diode element to the first metallic plate by at least one wire.
4. The method of manufacturing a light-emitting device according to claim 2 comprising:
when electrically connecting the second element electrodes of the light-emitting diode elements to the second metallic plates by wires, electrically connecting the first element electrodes of the light-emitting diode elements to the first metallic plates by wires.
5. A method of manufacturing a light-emitting device comprising:
positioning at least one first metallic plate in at least one first concave portion of a positioning frame and at least one second metallic plate in at least one second concave portion of the positioning frame;
adhering a surface of an adhesive sheet to the first metallic plate in the first concave portion of the positioning frame and the second metallic plate in the second concave portion of the positioning frame;
removing the first metallic plate and the second metallic plate that are adhered to the adhesive sheet, from the first concave portion and the second concave portion of the positioning frame;
filling a resin in spaces except the first metallic plate and the second metallic plate on the surface of the adhesive sheet to form a planar board including the first metallic plate and the second metallic plate connected by the resin;
removing the adhesive sheet from the planar board;
mounting at least one light-emitting diode element that includes a pair of element electrodes, on the first metallic plate and the second metallic plate, with the respective element electrodes of the light-emitting diode element in contact with the respective first and second metallic plates through bumps; and
forming a sealing resin on a side of the planar board, the side being a side where the light-emitting diode element is mounted on the first metallic plate and the second metallic plate.
6. The method of manufacturing a light-emitting device according to claim 5 comprising:
positioning a plurality of pairs of the first metallic plate and the second metallic plate in a plurality of pairs of the first concave portion and the second concave portion of a positioning frame;
adhering a surface of an adhesive sheet to the plurality of pairs of the first metallic plate and the second metallic plate;
removing the plurality of pairs of the first metallic plate and the second metallic plate that are adhered to the adhesive sheet, from the plurality of pairs of the first concave portion and the second concave portion of the positioning frame;
filling a resin in spaces except the plurality of pairs of the first metallic plate and the second metallic plate on the surface of the adhesive sheet to form a planar board including the plurality of pairs of the first metallic plate and the second metallic plate connected by the resin;
removing the adhesive sheet from the planar board;
mounting each of a plurality of light-emitting diode elements that each include a pair of a first element electrode and a second element electrode, on the first metallic plate and the second metallic plate of each pair, with the first element electrode in contact with the first metallic plate of each pair and with the second element electrode in contact with the second metallic plate of each pair through bumps;
forming a sealing resin on a side of the planar board, the side being a side where the plurality of light-emitting diode elements are mounted on the first metallic plates; and
dividing the sealing resin on the planar board into a plurality of light-emitting diode devices.