Microelectronic device provided with an array of elements made from a conductive polymer with a positive temperature coefficient

1. A method for production of a microelectronic device, comprising:

a) producing on a substrate one or more components of at least one electronic circuit, and of one or more metal levels of interconnection of the electronic circuit in at least one insulating layer;

b) producing multiple interconnection elements orthogonal to a principal plane of the substrate, traversing the insulating layer, wherein the elements are made from a positive temperature coefficient conductive polymer material; and

prior to the producing b), or to the producing a), or to manufacture of the device, determining at least one localized zone of heating of the electronic circuit that can reach a temperature higher than a predetermined threshold when the device is operating within a given current range; and

wherein the elements are positioned in the producing b) in accordance with the at least one localized heating zone.

2. A method according to claim 1 , wherein the interconnection elements are connected to a final metal layer from among the metal layers of interconnection of the components.

3. A method according to claim 1 , wherein the interconnection elements are arranged in an array.

4. A method according to claim 1 , wherein the array is formed from multiple other interconnection elements that are orthogonal to the principal plane of the substrate, traversing the insulating layer, wherein the other elements are made from a metal material.

5. A method according to claim 1 , wherein the elements made from positive temperature coefficient conductive polymer are formed in a first conductive zone, and configured to connect electrically the first conductive zone to a second conductive zone,

wherein the method further comprises, prior to the producing b), or the producing a), or to the manufacture of the device, determining at least one maximum current to flow between the first conductive zone and the second conductive zone, when the device is operating within a given range of temperatures, and wherein a number of elements and a size of the elements made from positive temperature coefficient conductive polymer, formed in the producing b), are chosen according to the value.

6. A method according to claim 1 , wherein a threshold temperature value which must not be exceeded for one or more components, or for at least a portion of the multiple interconnection elements, is determined beforehand, and wherein a number and/or geometry of the interconnection elements is determined according to the threshold temperature value.

7. A method according to claim 1 , wherein a maximum power be dissipated by the device during operation of the device is determined beforehand, and a number and/or geometry of the interconnection elements is determined according to the maximum power value.

8. A method according to claim 1 , wherein an acceptable current density that can traverse the multiple interconnection elements during operation of the device is determined beforehand, and a number and/or geometry of the interconnection elements is determined according to the acceptable current density value.

9. A microelectronic device comprising:

a substrate;

multiple components forming an electronic circuit on the substrate;

one or more superimposed metal levels of interconnections of the components, wherein the metal levels are located in at least one insulating layer resting on the substrate; and

multiple interconnection elements orthogonal to a principal plane of the substrate and made from a positive temperature coefficient conductive polymer material, wherein the elements traverse a thickness of the insulating layer and are connected to at least one conductive line of a given interconnection level, and wherein the elements made from a positive temperature coefficient conductive polymer material are positioned in a predetermined localized heating zone of the electronic circuit.

10. A device according to claim 9 , wherein the elements made from positive temperature coefficient conductive polymer material are arranged in an array.

11. A device according to claim 9 , wherein the array also includes conductive elements made from a metal material.

12. A device according to claim 9 , wherein the interconnection elements made from positive temperature coefficient conductive polymer are connected to the final metal level from among the metal interconnection levels.

13. A device according to claim 9 , wherein the elements made from a positive temperature coefficient conductive polymer material link connect electrically a first conductive zone and a second conductive zone, wherein a number and size of the interconnection elements made from positive temperature coefficient conductive polymer material are chosen:

so as to restrict current between the first conductive zone and a second conductive zone to a predetermined current value;

and/or so as to restrict an operating temperature to a threshold temperature value that must not be exceeded, whilst the device is in operation, for one or more components and/or for the multiple interconnection elements or for at least a portion of the multiple interconnection elements;

and/or to restrict power that can be dissipated by the device at maximum power, or to a threshold temperature that must not be exceeded, whilst this device is in operation;

and/or to restrict an acceptable current density that can traverse the multiple interconnection elements, when the device is in operation.

14. A device according to claim 9 , further comprising a circuit for controlling resistance of the interconnection elements.

15. A device according to claim 14 , wherein the control circuit enables increases in resistance of the interconnection elements due to an increase of overall temperature to be detected.

16. A device according to claim 14 , wherein the control circuit enables power currents of an integrated circuit connected to the interconnection elements to be restricted.