Nonvolatile semiconductor memory device and method of manufacturing the same

1. A nonvolatile semiconductor memory device including a first region having a plurality of electrically rewritable memory cells disposed therein, and a second region adjacent to the first region, the nonvolatile semiconductor memory device comprising:

a plurality of first conductive layers stacked in the first region and the second region and functioning as control electrodes of the memory cells in the first region, the plurality of first conductive layers including a stepped portion in the second region, positions of ends of the plurality of first conductive layers being different in the stepped portion;

a semiconductor layer surrounded by the first conductive layers in the first region, including a first columnar portion extending in a stacking direction, and functioning as a body of the memory cells;

a charge storage layer formed between the first conductive layers and a side surface of the first columnar portion and configured to enable storage of a charge and thereby retain data of the memory cells; and

an insulating columnar layer surrounded by the first conductive layers in the stepped portion, and including a second columnar portion extending in the stacking direction and comprising an insulator.

2. The nonvolatile semiconductor memory device according to claim 1 ,

wherein the semiconductor layer is disposed having a first pitch in a first direction orthogonal to the stacking direction, and

wherein the insulating columnar layer is disposed having a second pitch in the first direction, the second pitch being greater than the first pitch.

3. The nonvolatile semiconductor memory device according to claim 1 , further comprising:

a plurality of second conductive layers formed in the same layer as the first conductive layers and positioned on an upper portion of each of steps of the stepped portion; and

a contact layer extending in the stacking direction from the first conductive layers,

wherein the plurality of second conductive layers are formed in a periphery of the insulating columnar layer and are formed such that at least one of the plurality of second conductive layers is in contact with at least one of the first conductive layers, and

wherein the contact layer is provided separated from the at least one of the plurality of second conductive layers in contact with the at least one of the first conductive layers.

4. The nonvolatile semiconductor memory device according to claim 3 , further comprising:

a wall insulating layer formed surrounding a periphery of the first conductive layers; and

a plurality of third conductive layers formed surrounding the wall insulating layer and formed such that at least one of the plurality of third conductive layers is in contact with at least one of the first conductive layers,

wherein the contact layer is provided separated from the third conductive layers.

5. The nonvolatile semiconductor memory device according to claim 1 ,

wherein the insulating columnar layer is formed in a tapered shape such that a diameter of the insulating columnar layer becomes gradually smaller from an upper side to a lower side of the insulating columnar layer.

6. The nonvolatile semiconductor memory device according to claim 1 ,

wherein the insulating columnar layer is disposed in a matrix in the first direction and a second direction orthogonal to the first direction.

7. The nonvolatile semiconductor memory device according to claim 1 , further comprising a wall insulating layer formed surrounding a periphery of the first conductive layers,

wherein the second columnar portion is higher in the stacking direction than the wall insulating layer in the second region.

8. The nonvolatile semiconductor memory device according to claim 1 ,

wherein the plurality of first conductive layers are divided in a comb shape in the first region.

9. The nonvolatile semiconductor memory device according to claim 1 ,

wherein the first columnar portion is higher in the stacking direction than the second columnar portion.

10. The nonvolatile semiconductor memory device according to claim 1 ,

wherein, the semiconductor layer is disposed having a third pitch in a second direction orthogonal to the stacking direction an the first direction, and

the insulating columnar layer is disposed having the third pitch in the second direction.

11. A nonvolatile semiconductor memory device including a first region having a plurality of electrically rewritable memory cells disposed therein, and a second region adjacent to the first region, the nonvolatile semiconductor memory device comprising:

a plurality of first conductive layers stacked in the first region and the second region and including a stepped portion in the second region, positions of ends of the plurality of first conductive layers being different in the stepped portion;

an insulating columnar layer surrounded by the first conductive layers in the stepped portion, and including a second columnar portion extending in the stacking direction and comprising an insulator;

a plurality of second conductive layers formed in the same layer as the first conductive layers and positioned on an upper portion of each of steps of the stepped portion; and

a contact layer extending in the stacking direction from the first conductive layers,

the plurality of second conductive layers being formed in a periphery of the insulating columnar layer and being formed such that at least one of the plurality of second conductive layers is in contact with at least one of the first conductive layers, and

the contact layer being provided separated from the at least one of the plurality of second conductive layers in contact with the at least one of the first conductive layers.

12. The nonvolatile semiconductor memory device according to claim 11 , further comprising:

a wall insulating layer formed surrounding a periphery of the first conductive layers; and

a plurality of third conductive layers formed surrounding the wall insulating layer and formed such that at least one of the plurality of third conductive layers is in contact with at least one of the first conductive layers,

wherein the contact layer is provided separated from the third conductive layers.

13. The nonvolatile semiconductor memory device according to claim 11 ,

wherein the insulating columnar layer is formed in a tapered shape such that a diameter of the insulating columnar layer becomes gradually smaller from an upper side to a lower side of the insulating columnar layer.

14. The nonvolatile semiconductor memory device according to claim 11 ,

wherein the insulating columnar layer is disposed in a matrix in the first direction and a second direction orthogonal to the first direction.

15. The nonvolatile semiconductor memory device according to claim 11 , further comprising a wall insulating layer formed surrounding a periphery of the first conductive layers,

wherein the second columnar portion is higher in the stacking direction than the wall insulating layer in the second region.

16. The nonvolatile semiconductor memory device according to claim 11 ,

wherein the plurality of first conductive layers are divided in a comb shape in the first region.

17. The nonvolatile semiconductor memory device according to claim 11 ,

wherein the first columnar portion is higher in the stacking direction than the second columnar portion.