IP Library Granted Patent US 8,430,156
Granted Patent B2
US 8,430,156 · App. 10/835,956 · Granted Apr 30, 2013

Liquid loop with multiple pump assembly

Inventors: Christopher G. Malone (Loomis, CA); Glenn C. Simon (Auburn, CA)
Assignee: Hewlett-Packard Development Company, L.P.
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Quick Facts
Patent No.
US 8,430,156
App. No.
10/835,956
Filed
Apr 29, 2004
Granted
Apr 30, 2013
Kind
B2
Art Unit
3744
USPC
165/244
Abstract

A pump assembly includes inlet and outlet interfaces capable of coupling to a liquid cooling loop tubing, a plurality of pump connectors coupled to the inlet and outlet interfaces enabling pluggable connection of a plurality of pumps to the inlet and outlet interfaces, and a controller. The controller is coupled to the plurality of pumps and controls power levels of the individual pumps, enabling control of fluid flow rate in the liquid cooling loop.

Claims (49)

1. A pump assembly for an electronic liquid cooling system comprising:

inlet and outlet interfaces configured for coupling the pump assembly to a liquid cooling loop tubing;

a plurality of pumps required for attaining acceptable cooling levels based on characteristics of an underlying pump technology for the pump assembly;

a number of redundant pumps in addition to the plurality of pumps, wherein at least one of the number of redundant pumps is maintained as non-operational, and upon a prediction or detecting of a failure condition for the plurality of pumps, commences operation to meet an instantaneous cooling demand such that usage of the number of redundant pumps is eliminated unless warranted by conditions;

a plurality of quick-disconnect pump connectors, accommodating the plurality of pumps and the number of redundant pumps, coupled to the inlet and outlet interfaces, the plurality of quick-disconnect pump connectors configured for being inserted into and removed from the inlet and outlet interfaces without loss of liquid during operation of the pump assembly; and

a controller configured for coupling to the plurality of pumps and the number of redundant pumps, when installed, and controlling power levels of the individual pumps wherein fluid flow rate in the liquid cooling loop is controlled.

2. The pump assembly according to claim 1 further comprising:

a plurality of pumps installed and coupled to the plurality of pump connectors.

3. The pump assembly according to claim 1 further comprising:

a plurality of pumps installed and coupled to the plurality of pump connectors wherein the plurality of pump connectors connect the plurality of pumps in a configuration selected from among a group consisting of a serial connection, a parallel connection, and a combination serial and parallel connection.

4. The pump assembly according to claim 1 further comprising:

a plurality of pumps installed and coupled to the plurality of pump connectors; and

a check valve coupled to a pump of the plurality of pumps that prevents back-flow through a non-operating pump.

5. An electronic liquid cooling system comprising:

a tubing enclosing an interior bore or lumen within which a cooling fluid can circulate;

a plurality of pumps required for attaining acceptable cooling levels based on characteristics of an underlying pump technology for the pump assembly;

a number of redundant pumps in addition to the plurality of pumps, wherein at least one of the number of redundant pumps is maintained as non-operational, and upon a prediction or detecting of a failure condition for the plurality of pumps, commences operation to meet an instantaneous cooling demand such that usage of the number of redundant pumps is eliminated unless warranted by conditions, wherein the plurality of pumps and the number of redundant pumps are coupled via pluggable connections to the tubing, wherein the pluggable connections are a plurality of quick-disconnect pump connectors configured for being inserted into and removed from the inlet and outlet interfaces without loss of liquid during operation of the electronic liquid cooling system; and

a controller coupled to the plurality of pumps and the number of redundant pumps and controlling power levels of the individual pumps wherein fluid flow rate in the liquid cooling loop is controlled.

6. The system according to claim 5 further comprising:

a check valve coupled to a pump of the plurality of pumps that prevents back-flow through a non-operating pump.

7. The system according to claim 5 wherein:

the plurality of pumps coupled in a configuration selected from among a group consisting of a serial connection, a parallel connection, and a combination serial and parallel connection.

8. The system according to claim 5 wherein:

the controller operates in a mode that detects the number of pumps connected to the tubing and a maximum heat load, and controls power levels of the plurality of pumps based on the number of connected pumps and the maximum heat load.

9. An electronic system comprising:

a chassis including airflow inlet and outlet vents;

a plurality of components including heat-generating components mounted within the chassis; and

an electronic liquid cooling system comprising:

a tubing enclosing an interior bore or lumen within which a cooling fluid can circulate;

a plurality of pumps required for attaining acceptable cooling levels based on characteristics of an underlying pump technology for the pump assembly;

a number of redundant pumps in addition to the plurality of pumps, wherein at least one of the number of redundant pumps is maintained as non-operational, and upon a prediction or detecting of a failure condition for the plurality of pumps, commences operation to meet an instantaneous cooling demand such that usage of the number of redundant pumps is eliminated unless warranted by conditions, wherein the plurality of pumps and the number of redundant pumps are coupled via pluggable connections to the tubing, wherein the pluggable connections are a plurality of quick-disconnect pump connectors configured for being inserted into and removed from the inlet and outlet interfaces without loss of liquid during operation of the electronic liquid cooling system; and

a controller coupled to the plurality of pumps and the number of redundant pumps, that determines thermal conditions internal to the electronic system, and controls power levels of the individual pumps based on the thermal conditions wherein fluid flow rate in the liquid cooling loop is controlled.

10. The system according to claim 9 further comprising:

a check valve coupled to a pump of the plurality of pumps that prevents back-flow through a non-operating pump.

11. The system according to claim 9 further comprising:

the plurality of pumps coupled in a configuration selected from among a group consisting of a serial connection, a parallel connection, and a combination serial and parallel connection.

12. The system according to claim 9 wherein:

the controller operates in a mode that detects the number of pumps connected to the tubing and a maximum heat load, and controls power levels of the plurality of pumps based on the number of connected pumps and the maximum heat load.

13. A method of cooling an electronic system comprising:

configuring a liquid loop cooling system with a plurality of pumps coupled in combination;

determining thermal conditions within the electronic system;

maintaining a redundant pump of the plurality of pumps as non-operational;

predicting or detecting a failure condition;

in response to the failure condition, commencing operation of the redundant pump to meet an instantaneous cooling demand such that usage of the redundant pump is eliminated unless warranted by the failure condition; and

controlling power levels of the individual pumps based on the thermal conditions.

14. The method according to claim 13 further comprising:

detecting the number of pumps connected to the liquid loop cooling system;

detecting a maximum heat load of the electronic system; and

controlling power levels of the plurality of pumps according to the detected number of pumps and maximum heat load.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2015
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 037079/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2004
From: MALONE, CHRISTOPHER G.; SIMON, GLENN C.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 015289/0517 →
Continuity (1)
Related Publication 20050244280A1 · Nov 3, 2005