Structured polydiorganosiloxane polyamide containing devices and methods
Devices including a polydiorganosiloxane polyamide containing material having a microstructured surface are disclosed herein. Such devices can optionally include a flex circuit attached to the microstructured surface and can be useful, for example, in fluid handling applications.
1. A device comprising a polydiorganosiloxane polyamide containing material having a microstructured surface,
wherein the polydiorganosiloxane polyamide is a polydiorganosiloxane polyoxamide having a carbonyl group in the backbone and wherein the carbonyl group is bonded to another carbonyl group and is part of an oxalyl group.
2. The device of claim 1 , wherein the microstructured surface comprises at least one channel.
3. The device of claim 1 , wherein the microstructured surface comprises at least one well.
4. The device of claim 1 , further comprising a flex circuit attached to the microstructured surface.
5. The device of claim 1 , wherein the device is a fluid handling device.
6. The device of claim 1 , wherein the microstructured surface forms a capillary device.
7. The device of claim 1 , wherein the microstructured surface is hydrophilic.
8. A fluid handling device comprising:
a flex circuit; and
a structured material attached to the flex circuit, wherein the structured material comprises one or more polydiorganosiloxane polyamides, and wherein the polydiorganosiloxane polyamide is a polydiorganosiloxane polyoxamide having a carbonyl group in the backbone and wherein the carbonyl group is bonded to another carbonyl group and is part of an oxalyl group.
9. The fluid handling device of claim 8 , wherein the structured material is a microstructured material.
10. The fluid handling device of claim 9 , wherein the surface of the structured material that is attached to the flex circuit is a microstructured surface.
11. The fluid handling device of claim 8 , wherein the structured material is adhered directly to at least a portion of the flex circuit.
12. The fluid handling device of claim 11 , wherein the structured material is adhered directly to at least a portion of the flex circuit without additional adhesive.
13. The fluid handling device of claim 8 , wherein the flex circuit comprises a polyester substrate.
14. The fluid handling device of claim 13 , wherein the flex circuit comprises a polyethylene terephthalate substrate.
15. The fluid handling device of claim 8 , further comprising a source of potential.
16. A method of making a fluid handling device, the method comprising:
providing a structured material comprising one or more polydiorganosiloxane polyamides, wherein the polydiorganosiloxane polyamide is a polydiorganosiloxane polyoxamide having a carbonyl group in the backbone and wherein the carbonyl group is bonded to another carbonyl group and is part of an oxalyl group; and
attaching the structured material to a flex circuit.
17. The method of claim 16 , wherein the flex circuit comprises a film.
18. The method of claim 16 , wherein the flex circuit comprises a polyester substrate.
19. The method of claim 18 , wherein the flex circuit comprises a polyethylene terephthalate substrate.
20. The method of claim 16 , wherein attaching comprises heating the structured material.
21. The method of claim 16 , wherein attaching comprises applying pressure to the structured material.
22. The method of claim 16 wherein attaching does not comprise providing an additional adhesive material between the structured material and the flex circuit.
23. The method of claim 16 wherein the method does not comprise photolithography.
24. The method of claim 16 wherein the method does not comprise a wet chemical process.
25. A method of making a fluid handling device, the method comprising:
forming a microstructured surface on a surface of a polymeric material comprising one or more polydiorganosiloxane polyamides, wherein the polydiorganosiloxane polyamide is a polydiorganosiloxane polyoxamide having a carbonyl group in the backbone and wherein the carbonyl group is bonded to another carbonyl group and is part of an oxalyl group; and
attaching the microstructured surface to a flex circuit.