Packaging device for an electronic element and method for making the same
A method for making a packaging device for an electronic element includes: preparing a ceramic frame body defined with a hollow space for receiving the electronic element therein; preparing a ceramic substrate having a copper layer formed thereon; etching the copper layer to form a predetermined copper pattern on an upper surface of the ceramic substrate; placing the ceramic frame body onto the upper surface of the ceramic substrate and in contact with the copper pattern; and heating the ceramic frame body and the ceramic substrate such that the copper pattern bonds the ceramic frame body to the ceramic substrate. A packaging device for an electronic element is also disclosed.
1. A method for making a packaging device for an electronic element, said method comprising: preparing a ceramic frame body defined with a hollow space for receiving the electronic element therein and having a ceramic peripheral bottom surface; preparing a ceramic substrate having a copper layer formed thereon; etching the copper layer to form a predetermined copper pattern on an upper surface of the ceramic substrate; placing the ceramic frame body onto the upper surface of the ceramic substrate and in contact with the copper pattern; and heating the ceramic frame body and the ceramic substrate such that the copper layer eutectic bonds the ceramic peripheral bottom surface to the ceramic substrate, whereby the copper pattern formed on the ceramic substrate and the ceramic frame body are eutectic bonded to each other without using either one of adhesive and solder.
2. The method of claim 1 , wherein the step of etching includes forming a wiring region and a positioning element in the copper pattern, the positioning element being formed in a region where the ceramic frame body is bonded to the copper pattern.
3. The method of claim 2 , wherein the positioning element is a recess, and the ceramic frame body has a protrusion for the interference fit with the recess.
4. The method of claim 1 , further comprising before the etching step: coating a photosensitive layer on the copper layer; and exposing and developing the photosensitive later to define the copper pattern.
5. A packaging device for an electronic element, said packaging device comprising: a ceramic substrate; a copper layer having a predetermined copper pattern formed on an upper surface of said ceramic substrate; and a ceramic frame body having a ceramic peripheral bottom surface to which said copper layer on said ceramic substrate is eutectic bonded so as to define a hollow space for receiving the electronic element therein, whereby the copper pattern formed on the ceramic substrate and the ceramic frame body are eutectic bonded to each other without using either one of adhesive and solder.
6. The packaging device of claim 5 , wherein said copper pattern has a region provided with a positioning element, and said ceramic frame body is bonded to said region.
7. The packaging device of claim 6 , wherein said positioning element is a recess, and said ceramic frame body has a protrusion for interference fit with said recess.
8. The packaging device of claim 7 , wherein said copper pattern further has a wiring region for electrical connection with the electronic element.
9. The packaging device of claim 5 , wherein said ceramic frame body is in the form of a rectangle.
10. The packaging device of claim 5 , wherein said ceramic frame body is in the form of a circle.
11. The packaging device of claim 5 , wherein said ceramic frame body is in the form of a polygon.
12. The packaging device of claim 5 , wherein said ceramic frame body is in the form of a square.
13. The packaging device of claim 5 , wherein said ceramic frame body is made of aluminum oxide.
14. The packaging device of claim 5 , wherein said ceramic frame body is made of aluminum nitride.
15. The packaging device of claim 5 , wherein said ceramic frame body is made of titanium oxide.