Light emitting diode package having frame with bottom surface having two surfaces different in height
Provided is an LED package. It is easy to control luminance according to the luminance and an angle applicable. Since heat is efficiently emitted, the LED package is easily applicable to a high luminance LED. The manufacturing process is convenient and the cost is reduced. The LED package includes a substrate, an electrode, an LED, and a heatsink hole. The electrode is formed on the substrate. The LED is mounted in a side of the substrate and is electrically connected to the electrode. The heatsink hole is formed to pass through the substrate, for emitting out heat generated from the LED.
1. A light emitting device, comprising:
a substrate;
a light emitting diode chip on the substrate;
an electrode electrically connected to the light emitting diode chip;
a frame spaced apart from the light emitting diode chip and configured to reflect light emitted from the light emitting diode chip; and
at least one hole formed to pass through the substrate and configured to connect both upper and bottom surfaces of the substrate,
wherein a bottom surface of the frame has at least two surfaces different in height with reference to an imaginary surface where the light emitting diode chip is disposed.
2. The light emitting device of claim 1 , wherein a top surface of the frame is positioned higher than a top surface of the light emitting diode chip.
3. The light emitting device of claim 1 , wherein at least a portion of an inner surface of the frame is inclined, and an end portion of the inner surface of the frame is substantially vertical to the substrate.
4. The light emitting device of claim 1 , wherein a portion of the electrode is disposed underneath the frame.
5. The light emitting device of claim 1 , wherein a portion of the electrode extends between the frame and the substrate, and the electrode extends to the bottom of the substrate.
6. The light emitting device of claim 1 , wherein the frame comprises a different material than a material of the substrate.
7. The light emitting device of claim 1 , wherein the substrate is made of ceramic.
8. The light emitting device of claim 1 , wherein the at least one hole is formed under the light emitting diode chip and configured to dissipate heat generated from the light emitting diode chip.
9. The light emitting device of claim 1 , wherein the substrate has a heat dissipating member configured to dissipate heat generated from the light emitting diode chip.
10. The light emitting device of claim 9 , wherein the heat dissipating member is under the light emitting diode chip and is connected with the at least one hole so as to dissipate heat generated from the light emitting diode chip.
11. The light emitting device of claim 1 , further comprising a lens covering the light emitting diode chip.
12. The light emitting device of claim 11 , wherein a portion of the lens is in contact with the inner surface of the frame.