IP Library › Granted Patent US 8,434,225
Granted Patent B2
US 8,434,225 · App. 13/543,911 · Granted May 7, 2013

Hydrophilic particle enhanced heat exchange and method of manufacture

Inventors: Edward T. Mahefkey (Flowery Branch, GA); Louis Chow (Orlando, FL); Ming Su (Oviedo, FL)
Assignee: University of Central Florida Research Foundation, Inc.
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Quick Facts
Patent No.
US 8,434,225
App. No.
13/543,911
Granted
May 7, 2013
Kind
B2
Abstract

A method for manufacturing a heat pipe. Activated particles or particle clusters are formed. The activated particles or particle clusters are contacted with a working fluid in a non-oxidizing environment to form a chemisorbed layer of the working fluid thereon to generate chemisorbed working fluid surfaced activated hydrophilic particles or activated hydrophilic particle clusters which provide a solid-liquid contact angle to working fluid when subsequently added of <30 degrees. The chemisorbed working fluid surfaced activated hydrophilic particles or hydrophilic particle clusters are vacuum transferred and filled inside the heat pipe along with an additional volume of working fluid. The heat pipe is then sealed.

Claims (20)

1. A method for manufacturing a heat pipe, comprising:

removing surface impurities from a plurality of particles to form hydrophilic particles or hydrophilic particle clusters;

contacting said hydrophilic particles or said hydrophilic particle clusters with a working fluid in a non-oxidizing environment to form a chemisorbed layer of said working fluid thereon to generate chemisorbed working fluid surfaced hydrophilic particles or chemisorbed working fluid surfaced hydrophilic particle clusters which provide a solid-liquid contact angle to said working fluid when subsequently added of <30 degrees, and

vacuum transferring and filling said chemisorbed working fluid surfaced hydrophilic particles or said chemisorbed working fluid surfaced hydrophilic particle clusters and an additional volume of said working fluid inside said heat pipe, and

sealing said heat pipe.

2. The method of claim 1 , wherein said chemisorbed layer averages 2 to 10 monolayers thick.

3. The method of claim 1 , wherein said plurality of particles comprise silicon.

4. The method of claim 1 , wherein said solid-liquid contact angle is <10 degrees.

5. The method of claim 1 , wherein said heat pipe includes a wick having a plurality of pores, said plurality of pores having a pore size defining an interstitial pore volume that extends over a full thickness of said wick;

wherein said chemisorbed working fluid surfaced hydrophilic particles or said chemisorbed working fluid surfaced hydrophilic particle clusters are smaller than said pore size, are in a size range from nanosize to 5 microns, and are distributed throughout said interstitial pore volume, and

wherein said chemisorbed working fluid surfaced hydrophilic particles or said chemisorbed working fluid surfaced hydrophilic particle clusters occupy only a portion of said interstitial pore volume.

6. The method of claim 5 , wherein said pore size averages <100 μm.

7. The method of claim 5 , wherein said chemisorbed working fluid surfaced hydrophilic particles or said chemisorbed working fluid surfaced hydrophilic particle clusters fill 2 to 30% of said interstitial pore volume.

8. The method of claim 5 , wherein said chemisorbed working fluid surfaced hydrophilic particles or said chemisorbed working fluid surfaced hydrophilic particle clusters fill 2 to 10% of said interstitial pore volume.

9. The method of claim 5 , wherein a ratio of said pore size to a size of said chemisorbed working fluid surfaced hydrophilic particles or said chemisorbed working fluid surfaced hydrophilic particle clusters is from 100 to 10,000.

10. The method of claim 1 , wherein a casing of said heat pipe provides grooves having a groove space, and wherein said chemisorbed working fluid surfaced hydrophilic particles or said chemisorbed working fluid surfaced hydrophilic particle clusters occupy only a portion of said groove space.

11. The method of claim 1 , wherein said forming comprises chemically or thermally removing surface impurities from a plurality of particles.

12. The method of claim 1 , wherein said forming and said contacting comprises hydrothermal cracking of microparticle precursors while inside said heat pipe.

13. The method of claim 1 , wherein said working fluid comprises water, ammonia or methanol.

14. The method of claim 1 , wherein said hydrophilic particles or hydrophilic particle clusters /said working fluid comprises titania/water, silicon/water, activated charcoal/ammonia, or activated charcoal/methanol.

Continuity (3)
Continuation In Part 12755797 · Apr 7, 2010
Provisional Application 61167402 · Apr 7, 2009
Related Publication 20120279068A1 · Nov 8, 2012