Chemical modification of nanocrystal surfaces
View Patent ↗A method is disclosed. The method includes obtaining a precursor nanoparticle comprising a base material and a first ligand attached to the base material, and reacting the precursor nanoparticle with a reactant comprising a silicon bond, thereby removing the first ligand.
1. A method comprising:
obtaining a precursor nanoparticle comprising a base material and a first ligand attached to the base material; and
reacting the precursor nanoparticle with a reactant comprising:
a silicon bond of Si—X, wherein X comprises at least one atom selected from the group consisting of S, Se, and halide; and
a second ligand,
thereby removing the first ligand,
wherein after reacting, the second ligand is attached to the base material instead of the first ligand.
2. The method of claim 1 wherein the base material comprises a core material and a shell material surrounding the core material.
3. The method of claim 1 wherein the first ligand comprises an alkylphosphonate ligand, an alkylphosphinate ligand, or an alkylcarboxylate ligand.
4. The method of claim 1 wherein reacting the nanoparticle with the reactant comprising the silicon bond is performed in solution.
5. A nanoparticle comprising:
a base material; and
a ligand attached to the base material,
wherein the nanoparticle is formed by the method of claim 1 .
6. An electronic device comprising the nanoparticle of claim 5 .
7. The nanoparticle of claim 5
wherein the ligand comprises an atom selected from at least columns VI and VII of the periodic table.
8. The nanoparticle of claim 7 wherein the base material comprises a core material and a shell material.
9. The nanoparticle of claim 7 wherein the base material comprises only a core material, wherein the core material comprises a compound semiconductor.
10. The nanoparticle of claim 7 wherein the base material comprises CdSe.
11. An electronic device comprising the nanoparticle of claim 7 .
12. A method comprising:
obtaining a precursor nanoparticle comprising a base material and a first ligand attached to the base material; and
reacting the precursor nanoparticle with a reactant comprising a silicon bond, thereby removing the first ligand,
wherein the reactant comprises silicon and a second ligand, and wherein after reacting, the second ligand is attached to the base material instead of the first ligand, and wherein the second ligand includes a halide.
13. The method of claim 12 wherein the base material comprises a core material and a shell material surrounding the core material.
14. The method of claim 12 wherein the first ligand comprises an alkylphosphonate ligand, an alkylphosphinate ligand, or an alkylcarboxylate ligand.
15. The method of claim 12 wherein the reactant comprising silicon is a compound comprising silicon, wherein the compound comprising silicon comprises Si—X, wherein X comprises at least one atom selected from the group consisting of S, Se, and halides.
16. The method of claim 12 wherein reacting the nanoparticle with the reactant comprising silicon is performed in solution.
17. A nanoparticle formed by the method of claim 12 .
18. An electronic device comprising the nanoparticle of claim 17 .
19. The nanoparticle of claim 7
wherein the ligand comprises an atom from column VII of the periodic table.
20. The nanoparticle of claim 19 wherein the base material comprises a core material and a shell material.
21. The nanoparticle of claim 19 wherein the base material comprises only a core material, wherein the core material comprises a compound semiconductor.
22. The nanoparticle of claim 19 wherein the base material comprises CdSe.
23. An electronic device comprising the nanoparticle of claim 19 .