IP Library Granted Patent US 8,435,899
Granted Patent B2
US 8,435,899 · App. 12/555,195 · Granted May 7, 2013

Method for producing columnar structured material

Inventors: Hirokatsu Miyata (Hadano, JP); Albrecht Otto (Atsugi, JP); Akira Kuriyama (Atsugi, JP); Miki Ogawa (Tokyo, JP); Hiroshi Okura (Hiratsuka, JP); Kazuhiko Fukutani (Santa Cruz, CA); Tohru Den (Tokyo, JP)
Assignee: Canon Kabushiki Kaisha
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Quick Facts
Patent No.
US 8,435,899
App. No.
12/555,195
Granted
May 7, 2013
Kind
B2
Abstract

A microcolumnar structured material having a desired material. The columnar structured material includes columnar members obtained by introducing a filler into columnar holes formed in a porous material. The porous material has the columnar holes formed by removing columnar substances from a structured material in which the columnar substances containing a first component are dispersed in a matrix member containing a second component capable of forming a eutectic with the first component. The matrix member may be removed. In the columnar structured material, the filler is a conductive material, and an electrode can be structured by electrically connecting the conductive materials in at least a part of a plurality of holes to a conductor.

Claims (10)

1. A method for producing an electrode having a plurality of columnar members, comprising:

a step of preparing a structured material in which columnar-shaped substances containing aluminum are dispersed in an amorphous matrix member containing silicon or germanium capable of forming a eutectic with aluminum by a sputtering process;

a removing step of removing the columnar-shaped substances for forming columnar holes;

an introducing step of introducing a conductive filler into the columnar holes;

a step of removing the amorphous matrix member to form a structure in which a plurality of columnar members including the conductive filler are arranged on a substrate; and

a step of providing a conductive material to the structure from a side opposite to the substrate to electrically connect the conductive material to the plurality of columnar members.

2. The method according to claim 1 , further comprising a step of subjecting the structured material to a chemical treatment after the removing step.

3. The method according to claim 1 , wherein the removing step is performed by etching.

4. The method according to claim 1 , further comprising a step of processing the plurality of columnar members to change their size.

5. The method according to claim 1 , further comprising a step of forming an insulator to a part of the plurality of columnar members.

Priority Claims (1)
JP 2002-363130 · Dec 13, 2002 · national
Continuity (2)
Division 10538127
Related Publication 20100003822A1 · Jan 7, 2010