IP Library › Granted Patent US 8,436,307
Granted Patent B2
US 8,436,307 · App. 13/046,890 · Granted May 7, 2013

Multi-cavity optical sensing and thermopile infrared sensing system

Inventors: Koon-Wing Tsang (Fremont, CA); Cheng-Chung Shih (Fremont, CA)
Assignee: Capella Microsystems Corp.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,436,307
App. No.
13/046,890
Granted
May 7, 2013
Kind
B2
Abstract

The present invention discloses a multi-cavity optical sensing and thermopile infrared sensing system, which comprises an optical sensing part, a dielectric layer, a plurality of optical cavities, and a plurality of thermocouples. The dielectric layer covers on the top of the optical sensing part. The optical cavities are formed by a plurality of metal reflectors inside the dielectric layer. The thermocouples are laterally disposed near the bottom of the dielectric layer. In addition, a low temperature region is formed in an area which is the overlapping of vertical projections of such thermocouples and the optical sensing part; a high temperature region is formed by the overlapping of vertical projections of such thermocouples, but without the overlaying which belongs to the vertical projection of the optical sensing part. Therefore, the system can sense the ambient light brightness, color conditions and human blackbody infrared signals within the range of 8-12 micrometers wavelength.

Claims (25)

1. A multi-cavity optical sensing and thermopile infrared sensing system, comprising:

an optical sensing part;

a dielectric layer covering on the top of the optical sensing part;

a first optical cavity formed by a first metal reflective layer and a second metal reflective layer inside the dielectric layer;

a first thermocouple laterally disposed inside and near the bottom of the dielectric layer; and

a second thermocouple laterally disposed inside and near the bottom of the dielectric layer wherein the second thermocouple is disposed parallel to and above the first thermocouple;

wherein, in the dielectric layer, a low temperature region is formed in an area which is the overlapping of vertical projections of the first thermocouple, the second thermocouple and the optical sensing part; a high temperature region is formed by the overlapping of vertical projections of the first thermocouple and the second thermocouple, but without the overlaying which belongs to the vertical projection of the optical sensing part.

2. The multi-cavity optical sensing and thermopile infrared sensing system as defined in claim 1 , further comprising:

a third thermocouple laterally disposed relatively to the first thermocouple near the bottom of the dielectric layer; and

a fourth thermocouple laterally disposed relatively to the second thermocouple and above the third thermocouple in parallel;

wherein, in the dielectric layer, a low temperature region is formed in an area which is the overlapping of vertical projections of the first thermocouple, the second thermocouple, the third thermocouple, the fourth thermocouple and the optical sensing part; a high temperature region is formed by the overlapping of vertical projections of the first thermocouple, the second thermocouple, the third thermocouple, and the fourth thermocouple, but without the overlaying which belongs to the vertical projection of the optical sensing part.

3. The multi-cavity optical sensing and thermopile infrared sensing system as defined in claim 1 , wherein the optical sensing part further comprises:

a base body;

an epitaxial layer formed on a top end of the base body; and

a plurality of N+ electrode sections formed on the epitaxial layer thereof.

4. The multi-cavity optical sensing and thermopile infrared sensing system as defined in claim 1 , further comprising:

a second optical cavity formed in the dielectric layer by the second metal reflective layer and a third metal reflective layer, wherein the second optical cavity is set nearby the first optical cavity in a stepped pattern.

5. The multi-cavity optical sensing and thermopile infrared sensing system as defined in claim 4 , wherein the first optical cavity and the second optical cavity comprise different spectrum response.

6. The multi-cavity optical sensing and thermopile infrared sensing system as defined in claim 1 , further comprising:

a thermoelectric conversion unit disposed between the high temperature section and the low temperature section to receive a high temperature and a low temperature and further to converse the temperature difference into a potential difference.

7. The multi-cavity optical sensing and thermopile infrared sensing system as defined in claim 1 , wherein the dielectric layer comprises a nitride silicon (Si3N4) layer, a silicon dioxide (SiO2) layer, or the mixture of both.

8. The multi-cavity optical sensing and thermopile infrared sensing system as defined in claim 1 , wherein the first thermocouple and the third thermocouple are N-type thermocouples.

9. The multi-cavity optical sensing and thermopile infrared sensing system as defined in claim 1 , wherein the second thermocouple and the fourth thermocouple are P-type thermocouples.

10. The multi-cavity optical sensing and thermopile infrared sensing system as defined in claim 1 , wherein the metal reflective layers comprise aluminum (Al), gold (Au), or silver (Ag).

11. The multi-cavity optical sensing and thermopile infrared sensing system as defined in claim 1 , wherein the multi-cavity optical sensing and thermopile infrared sensing system is completed by the technology of complementary metal oxide semiconductor (CMOS), bipolar transistor, or bi-complementary metal oxide semiconductor (BiCMOS).

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2016
From: CAPELLA MICROSYSTEMS, CORP.
To: VISHAY CAPELLA MICROSYSTEMS (TAIWAN) LIMITED
Reel/Frame 037817/0771 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2011
From: TSANG, KOON-WING; SHIH, CHENG-CHUNG
To: CAPELLA MICROSYSTEMS, CORP.
Reel/Frame 025946/0255 →
Continuity (2)
Provisional Application 61364800 · Jul 15, 2010
Related Publication 20120012966A1 · Jan 19, 2012