Surface acoustic wave filter device
A small-sized surface acoustic wave filter device having favorable filter characteristics includes a transmission-side surface acoustic wave filter chip including a ladder surface acoustic wave filter unit located on a piezoelectric substrate. The ladder surface acoustic wave filter unit includes a series arm connected between an input pad and an output pad and a plurality of resonators and including at least one first resonator connected to the input pad or the output pad. A die-attach surface is provided with an inductor connected to the first resonator. The inductor is arranged such that at least a portion thereof faces the first resonator and does not face any of the plurality of resonators and other than the first resonator.
1. A surface acoustic wave filter device comprising:
a wiring board including a die-attach surface; and
a surface acoustic wave filter chip flip-chip mounted on the die-attach surface of the wiring board; wherein
the surface acoustic wave filter chip includes a piezoelectric substrate and a ladder surface acoustic wave filter unit located on the piezoelectric substrate;
the ladder surface acoustic wave filter unit includes an input pad, an output pad, a series arm connecting the input pad and the output pad, and a plurality of resonators including at least one first resonator connected to the input pad or the output pad;
the die-attach surface of the wiring board is provided with an inductor connected to the first resonator;
the inductor is arranged such that at least a portion thereof faces the first resonator but does not face any of the plurality of resonators other than the first resonator;
the wiring board includes an input terminal connected to the input pad and an output terminal connected to the output pad;
the plurality of resonators include a plurality of series arm resonators connected in series in the series arm and at least one parallel arm resonator connected between the series arm and a ground potential;
the first resonator is one of the plurality of series arm resonators; and
the inductor is connected between the first resonator and the input terminal or between the first resonator and the output terminal.
2. The surface acoustic wave filter device described in claim 1 , wherein the surface acoustic wave filter device is a branching filter.
3. A surface acoustic wave filter device comprising:
a wiring board including a die-attach surface; and
a surface acoustic wave filter chip flip-chip mounted on the die-attach surface of the wiring board; wherein
the surface acoustic wave filter chip includes a piezoelectric substrate and a ladder surface acoustic wave filter unit located on the piezoelectric substrate;
the ladder surface acoustic wave filter unit includes an input pad, an output pad, a series arm connecting the input pad and the output pad, and a plurality of resonators including at least one first resonator connected to the input pad or the output pad;
the die-attach surface of the wiring board is provided with an inductor connected to the first resonator;
the inductor is arranged such that at least a portion thereof faces the first resonator but does not face any of the plurality of resonators other than the first resonator;
the wiring board includes an input terminal connected to the input pad and an output terminal connected to the output pad;
the plurality of resonators include a plurality of series arm resonators connected in series in the series arm and at least one parallel arm resonator connected between the series arm and a ground potential;
the first resonator is one of the at least one parallel arm resonator; and
the inductor is connected between the first resonator and the input terminal or between the first resonator and the output terminal.
4. The surface acoustic wave filter device described in claim 3 , wherein the surface acoustic wave filter device is a branching filter.
5. A surface acoustic wave filter device comprising:
a wiring board including a die-attach surface; and
a surface acoustic wave filter chip flip-chip mounted on the die-attach surface of the wiring board; wherein
the surface acoustic wave filter chip includes a piezoelectric substrate and a ladder surface acoustic wave filter unit located on the piezoelectric substrate;
the ladder surface acoustic wave filter unit includes an input pad, an output pad, a series arm connecting the input pad and the output pad, and a plurality of resonators including at least one first resonator connected to the input pad or the output pad;
the die-attach surface of the wiring board is provided with an inductor connected to the first resonator;
the inductor is arranged such that at least a portion thereof faces the first resonator but does not face any of the plurality of resonators other than the first resonator;
the wiring board includes an input terminal connected to the input pad and an output terminal connected to the output pad;
the plurality of resonators include a plurality of series arm resonators connected in series in the series arm and at least one parallel arm resonator connected between the series arm and a ground potential;
the first resonator is one of the plurality of series arm resonators; and
the inductor is connected in parallel with the first resonator.
6. The surface acoustic wave filter device described in claim 5 , wherein the surface acoustic wave filter device is a branching filter.