IP Library › Granted Patent US 843,957
Granted Patent S1
US 843,957 · App. 29/638,942 · Granted Mar 26, 2019

Light emitting diode package

Inventors: Chuan-Yu Liu (Tainan, TW); Xun-Xain Zhan (Tainan, TW); Chun-Ming Tseng (Tainan, TW); Yu-Jung Wu (Tainan, TW); Yu-Feng Lin (Tainan, TW)
Assignee: Genesis Photonics Inc.
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Quick Facts
Patent No.
US 843,957
App. No.
29/638,942
Granted
Mar 26, 2019
Kind
S1
Claims (1)

The ornamental design for a light emitting diode package, as shown and described.

Assignments (2)
ADDRESS CHANGE REGISTRATION FORM Recorded Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: GENESIS PHOTONICS INC.
Reel/Frame 066044/0133 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: NICHIA CORPORATION
Reel/Frame 066044/0807 →
Priority Claims (1)
TW 105305761 · Sep 29, 2016 · national
Continuity (1)
Division 29598778 · Mar 28, 2017