IP Library Granted Patent US 8,441,772
Granted Patent B2
US 8,441,772 · App. 12/910,493 · Granted May 14, 2013

Substrate for electrostatic chuck and electrostatic chuck

Inventors: Tadayoshi Yoshikawa (Nagano, JP); Koki Tamagawa (Nagano, JP); Naoto Watanabe (Nagano, JP)
Assignee: Shinko Electric Industries Co., Ltd.
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Quick Facts
Patent No.
US 8,441,772
App. No.
12/910,493
Granted
May 14, 2013
Kind
B2
Abstract

An electrostatic chuck includes a metal base member and an insulating substrate having an opposite surface to an attraction surface joined onto the base member via an adhesive layer. In the substrate, an electrode layer to which a direct current voltage for attraction is applied is embedded in a portion of the substrate, close to the attraction surface. In addition, a plurality of independent RF electrode layers to which different radio frequencies for plasma control are fed, respectively, are embedded in portions of the substrate, at an opposite side of the first electrode layer to the attraction surface. The RF electrode layers are arranged separately in different layers which are not on an identical plane in such a manner as to partially overlap each other in a plan view.

Claims (17)

1. A substrate for an electrostatic chuck which has insulation quality and can be joined onto a metal base member, the substrate for an electrostatic chuck comprising:

a first single, continuous electrode layer embedded in the substrate, close to an attraction surface which is an opposite side to a side to be joined to the base member; and

a plurality of independent second electrode layers embedded in the substrate, at an opposite side to the single, continuous first electrode layer, the second electrode layers being divided and which electrically insulate each other,

wherein an attraction direct current voltage is applied to the single, continuous first electrode layer, and different radio frequencies for plasma control are fed to the plurality of independent second electrode layers, respectively.

2. The substrate for electrostatic chuck according to claim 1 , wherein the plurality of second electrode layers include an electrode layer arranged in a center portion in a plan view and at least one electrode layer arranged in a ring shape around the electrode layer in the center portion, and the electrode layers constituting the plurality of second electrode layers are arranged separately in different layers which are not on an identical plane.

3. The substrate for electrostatic chuck according to claim 2 , wherein the electrode layers constituting the plurality of second electrode layers are arranged in such a manner as to partially overlap each other in a plan view.

4. The substrate for electrostatic chuck according to claim 1 , wherein the plurality of second electrode layers include an electrode layer arranged in a center portion in a plan view and at least one electrode layer arranged in a ring shape around the electrode layer in the center portion, and the electrode layers constituting the plurality of second electrode layers are arranged separately on an identical plane.

5. The substrate for electrostatic chuck according to claim 1 , wherein the electrode layers constituting the plurality of second electrode layers are each quadrangular in a plan view, and are arranged either separately on an identical plane, or separately in different layers which are not on an identical plane.

6. An electrostatic chuck comprising:

a metal base member; and

an insulating substrate having an attraction surface and an opposite surface to the attraction surface, the opposite surface being joined onto the base member via an adhesive layer, wherein the substrate includes:

a first single, continuous electrode layer embedded in the substrate, close to the attraction surface; and

a plurality of independent second electrode layers embedded in the substrate, at an opposite side to the single, continuous first electrode layer, wherein an attraction direct current voltage is applied to the single, continuous first electrode layer, and different radio frequencies for plasma control are fed to the plurality of independent second electrode layers, respectively.

7. The electrostatic chuck according to claim 6 , wherein the plurality of second electrode layers include an electrode layer arranged in a center portion in a plan view and at least one electrode layer arranged in a ring shape around the electrode layer in the center portion, and the electrode layers constituting the plurality of second electrode layers are arranged separately in different layers which are not on an identical plane.

8. The electrostatic chuck according to claim 7 , wherein the electrode layers constituting the plurality of second electrode layers are arranged in such a manner as to partially overlap each other in a plan view.

9. The electrostatic chuck according to claim 6 , wherein the plurality of second electrode layers include an electrode layer arranged in a center portion in a plan view and at least one electrode layer arranged in a ring shape around the electrode layer in the center portion, and the electrode layers constituting the plurality of second electrode layers are arranged separately on an identical plane.

10. The electrostatic chuck according to claim 6 , wherein the electrode layers constituting the plurality of second electrode layers are each quadrangular in a plan view, and are arranged either separately on an identical plane, or separately in different layers which are not on an identical plane.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 5, 2010
From: YOSHIKAWA, TADAYOSHI; TAMAGAWA, KOKI; WATANABE, NAOTO
To: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Reel/Frame 025326/0801 →
Priority Claims (2)
JP 2009-245268 · Oct 26, 2009 · national
JP 2010-207515 · Sep 16, 2010 · national
Continuity (1)
Related Publication 20110096461A1 · Apr 28, 2011