Method of manufacturing semiconductor device and semiconductor device
A method of manufacturing a semiconductor device includes steps of forming a semiconductor device layer on an upper surface of a substrate including the upper surface, a lower surface and a dislocation concentrated region arranged so as to part a first side closer to the upper surface and a second side closer to the lower surface, exposing a portion where the dislocation concentrated region does not exist above on the lower surface by removing the substrate on the second side along with at least a part of the dislocation concentrated region, and forming an electrode on the portion.
1. A method of manufacturing a semiconductor device, comprising steps of:
forming a semiconductor device layer on an upper surface of a substrate; the substrate including said upper surface, a lower surface and a dislocation concentrated region arranged so as to part a first side closer to said upper surface and a second side closer to said lower surface;
exposing a portion of said lower surface where said dislocation concentrated region does not exist above on said lower surface by removing said substrate on said second side along with at least a part of said dislocation concentrated region; and
forming an electrode on said portion.
2. The method of manufacturing a semiconductor device according to claim 1 , wherein
said dislocation concentrated region is so arranged as to extend substantially parallel to said upper surface, and
said step of exposing said portion includes a step of exposing said portion by removing said substrate on said second side so as to remove substantially all of said dislocation concentrated region extending substantially parallel to said upper surface.
3. The method of manufacturing a semiconductor device according to claim 2 , wherein
said substrate includes a lower portion, said dislocation concentrated region arranged on said lower portion and an upper portion so arranged on said dislocation concentrated region that said dislocation concentrated region is not exposed on said upper surface.
4. The method of manufacturing a semiconductor device according to claim 3 , wherein
said step of forming said semiconductor device layer on said upper surface includes a step of forming said semiconductor device layer on said portion.
5. The method of manufacturing a semiconductor device according to claim 3 , wherein
said step of exposing said portion includes a step of removing all of said lower portion, all of said dislocation concentrated region and a part of said upper portion so that said dislocation concentrated region does not exist above a substantially overall region of a portion exposed on said lower surface.
6. The method of manufacturing a semiconductor device according to claim 5 , wherein
said step of forming said electrode includes a step of forming said electrode on said lower surface where said dislocation concentrated region does not exist.
7. The method of manufacturing a semiconductor device according to claim 1 , wherein
said dislocation concentrated region is so arranged as to obliquely extend with respect to said upper surface,
said step of exposing said portion includes a step of exposing said portion by removing said substrate on said second side so as to remove at least a part of said dislocation concentrated region.
8. The method of manufacturing a semiconductor device according to claim 1 , wherein
said upper surface is substantially equal to a nonpolar plane.
9. The method of manufacturing a semiconductor device according to claim 1 , wherein
said step of forming said semiconductor device layer includes a step of forming a waveguide on said semiconductor device layer, and
said waveguide extends along a [1-100] direction.