Method of manufacturing a semiconductor laser
Provided is a semiconductor laser, wherein (λa−λw)>15 (nm) and Lt<25 (μm), where λw is the wavelength of light corresponding to the band gap of the active layer disposed at a position within a distance of 2 μm from one end surface in a resonator direction, λa is the wavelength of light corresponding to the band gap of the active layer disposed at a position that is spaced a distance of equal to or more than ( 3/10)L and ≦( 7/10)L from the one end surface in a resonator direction, “L” is the resonator length, and “Lt” is the length of a transition region provided between the position of the active layer with a band gap corresponding to a light wavelength of λw+2 (nm) and the position of the active layer with a band gap corresponding to a light wavelength of λa−2 (nm) in the resonator direction.
1. A method of manufacturing a semiconductor laser, comprising:
forming an active layer over a substrate; and
diffusing impurities into a region near an end surface of said active layer to alloy said active layer, wherein said alloying said active layer includes:
preparing a semiconductor layer A and a semiconductor layer B;
sequentially forming said semiconductor layer B and said semiconductor layer A over said active layer when the solid solubility limit concentration of said semiconductor layer A with respect to said impurities is Ma and the solid solubility limit concentration of said semiconductor layer B with respect to said impurities is Mb (Ma>Mb);
forming a groove in said semiconductor layer A between a region where said region near said end surface is to be formed and a region where a region other than said region near said end surface is to be formed; and
forming a layer including said impurities so as to come into contact with only the surface of said first semiconductor layer A in said region where said region near said end surface is to be formed or exposing only the surface of said semiconductor layer A in said region where said region near said end surface is to be formed to a gas including said impurities, and diffusing said impurities into said active layer in said region where said region near said end surface is to be formed through said semiconductor layer A and said semiconductor layer B.
2. The method of manufacturing a semiconductor laser as set forth in claim 1 , wherein, when said semiconductor layer A is a cap layer and said semiconductor layer B is a clad layer, said cap layer remains over said clad layer in said region where said region other than said region near said end surface is to be formed.
3. The method of manufacturing a semiconductor laser as set forth in claim 1 , wherein, when said semiconductor layer A is a cap layer and said semiconductor layer B is a clad layer, said cap layer remains over said clad layer in said region where said region near said end surface is to be formed.
4. The method of manufacturing a semiconductor laser as set forth in claim 1 , wherein, when said semiconductor layer A is a cap layer and said semiconductor layer B is a clad layer, said cap layer over said clad layer is removed in said region where said region near said end surface is to be formed, and a current block layer is formed over said clad layer.
5. The method of manufacturing a semiconductor laser as set forth in claim 4 , wherein said current block layer is a single layer or a multi-layer structure.
6. The method of manufacturing a semiconductor laser as set forth in claim 1 , wherein said step of forming said groove includes:
forming a layer that prevents the diffusion of said impurities, in said groove.
7. The method of manufacturing a semiconductor laser as set forth in claim 1 , wherein said impurities are Zn.
8. The method of manufacturing a semiconductor laser as set forth in claim 1 , wherein a material forming said semiconductor layer B includes GaInP, AlGaInP, or AlGaAs.
9. The method of manufacturing a semiconductor laser as set forth in claim 1 , wherein a material forming said semiconductor layer A includes GaAs.
10. The method of manufacturing a semiconductor laser as set forth in claim 1 , wherein said layer including said impurities is a ZnO film formed by a sputtering method.
11. The method of manufacturing a semiconductor laser as set forth in claim 1 , wherein said semiconductor laser is self-oscillated.
12. A method of diffusing impurities into a semiconductor layer B through a semiconductor layer A, comprising:
preparing said semiconductor layer A and said semiconductor layer B;
forming said semiconductor layer A over said semiconductor layer B when the solid solubility limit concentration of said semiconductor layer A with respect to said impurities is Ma and the solid solubility limit concentration of said semiconductor layer B with respect to said impurities is Mb (Ma>Mb);
forming a groove in said semiconductor layer A, to form a first semiconductor layer A and a second semiconductor layer A over said semiconductor layer B; and
forming a layer including said impurities so as to come into contact with only the surface of said first semiconductor layer A and diffusing said impurities into said semiconductor layer B through said first semiconductor layer A.
13. The method of diffusing impurities as set forth in claim 12 , wherein said impurities are Zn.
14. The method of diffusing impurities as set forth in claim 12 , wherein a material forming said semiconductor layer B includes GaInP, AlGaInP, or AlGaAs.
15. The method of diffusing impurities as set forth in claim 12 , wherein a material forming said semiconductor layer A includes GaAs.