Self-aligned carbon electronics with embedded gate electrode
A device and method for device fabrication includes forming a buried gate electrode in a dielectric substrate and patterning a stack that includes a high dielectric constant layer, a carbon-based semi-conductive layer and a protection layer over the buried gate electrode. An isolation dielectric layer formed over the stack is opened to define recesses in regions adjacent to the stack. The recesses are etched to form cavities and remove a portion of the high dielectric constant layer to expose the carbon-based semi-conductive layer on opposite sides of the buried gate electrode. A conductive material is deposited in the cavities to form self-aligned source and drain regions.
1. A method for fabricating a device, comprising:
forming a buried gate electrode in a dielectric substrate;
patterning a stack comprising a high dielectric constant layer, a carbon-based layer and a protection layer over the buried gate electrode;
opening an isolation dielectric layer formed over the stack to define recesses in regions adjacent to the stack;
etching the recesses to form cavities and remove a portion of the high dielectric constant layer to expose the carbon-based layer on opposite sides of the buried gate electrode; and
depositing a conductive material in the cavities to form self-aligned source and drain regions.
2. The method for fabricating a device according to claim 1 , wherein forming a buried gate electrode in a dielectric substrate includes:
forming a recess through a first dielectric material of the substrate and into a second dielectric material of the substrate;
forming a dielectric spacer in the recess; and
depositing a gate electrode conductor over the spacer in the recess.
3. The method for fabricating a device according to claim 1 , wherein patterning the stack includes depositing one or more of hafnium dioxide, zirconium dioxide and titanium dioxide to form the high dielectric constant layer.
4. The method for fabricating a device according to claim 1 , wherein patterning the stack includes depositing a dielectric layer having a dielectric constant greater than 3.9 to form the high dielectric constant layer.
5. The method for fabricating a device according to claim 1 , wherein patterning the stack includes employing a lithographic process to form an etch mask, and etching the stack to provide the stack over the buried gate electrode.
6. The method for fabricating a device according to claim 1 , wherein patterning the stack includes depositing the carbon-based layer by a chemical vapor deposition (CVD) or a plasma enhanced chemical vapor deposition (PECVD) process.
7. The method for fabricating a device according to claim 1 , wherein patterning the stack includes forming the carbon-based layer directly on the high dielectric constant layer.
8. The method for fabricating a device according to claim 1 , wherein the substrate includes a first dielectric material and a second dielectric material, and the step of etching the recesses to form cavities and remove a portion of the high dielectric constant layer includes etching the first dielectric layer down to the second dielectric layer to form the cavities.
9. The method for fabricating a device according to claim 8 , further comprising wet etching the cavities to remove the portion of the high dielectric constant layer to expose the carbon-based layer.
10. The method for fabricating a device according to claim 9 , further comprising depositing an encapsulation layer formed from a high dielectric constant material in the cavities to refill an undercut formed by the wet etching.
11. The method for fabricating a device according to claim 1 , wherein depositing a conductive material in the cavities to form self-aligned source and drain regions includes depositing the conductive material by employing atomic layer deposition to form the conductive material in contact with the carbon-based layer.
12. The method for fabricating a device according to claim 1 , wherein the carbon-based layer includes one of carbon nanotubes, carbon nanoribbons and a graphene layer.
13. A method for fabricating a device, comprising:
forming a recess through a first dielectric material of a substrate and into a second dielectric material of the substrate;
forming a dielectric spacer in the recess;
depositing a gate electrode conductor over the spacer in the recess;
planarizing the gate electrode conductor and the dielectric spacer to remove access materials above the recess to form a buried gate electrode in the substrate;
forming a stack comprising a high dielectric constant layer, a carbon-based layer and a protection layer;
employing a lithographic process to form an etch mask and etching the stack to provide a portion of the stack over the buried gate electrode;
opening an isolation dielectric layer formed over the stack to define recesses in regions adjacent to the stack;
etching the recesses to form cavities and remove a portion of the high dielectric constant layer to expose the carbon-based layer on opposite sides of the buried gate electrode; and
depositing a conductive material in the cavities to form self-aligned source and drain regions by employing atomic layer deposition to form the conductive material in contact with the carbon-based semi-conducting layer.
14. The method for fabricating a device according to claim 13 , wherein patterning the stack includes depositing a dielectric layer having a dielectric constant greater than 3.9 to form the high dielectric constant layer.
15. The method for fabricating a device according to claim 13 , wherein forming the stack includes depositing the carbon-based layer by a chemical vapor deposition (CVD) or a plasma enhanced chemical vapor deposition (PECVD) process.
16. The method for fabricating a device according to claim 13 , wherein etching the recesses to form cavities includes etching the first dielectric layer down to the second dielectric layer to form the cavities.
17. The method for fabricating a device according to claim 16 , further comprising wet etching the cavities to remove the portion of the high dielectric constant layer to expose the carbon-based layer.
18. The method for fabricating a device according to claim 17 , further comprising depositing an encapsulation layer formed from a high dielectric constant material in the cavities to refill an undercut formed by the wet etching.