Microcavity plasma devices with non-uniform cross-section microcavities
An embodiment of the invention IS an array of microcavity plasma devices The array includes a first metal film electrode with a plurality of non-uniform cross-section microcavities therein that are encapsulated in oxide A second electrode is a thin metal foil encapsulated in oxide that is bonded to the first electrode A packaging layer contains gas or vapor in the non-uniform cross-section microcavities To make such device, photoresist is patterned to encapsulate the anodized foil or film except on a top surface at desired positions of microcavities A second anodization or electrochemical etching is conducted to form the non-uniform cross-section sidewall microcavities cavities After removing photoresist and metal oxide, a final anodization lines the walls of the microcavities with metal oxide and fully encapsulates the metal electrodes with metal oxide.
1. An array of microcavity devices, comprising:
a first electrode, the first electrode being a thin metal foil or film including a plurality of non-uniform cross-section microcavities therein and being encapsulated in oxide of the metal of the thin metal foil;
a second electrode being a thin metal foil encapsulated in oxide that is bonded to the first electrode, the oxide preventing contact between the first and second electrodes;
at least one packaging layer that contains discharge medium in the microcavities.
2. An array of claim 1 , wherein the microcavities have bowl shaped sidewalls.
3. The array of claim 1 , wherein the microcavities have tapered sidewalls.
4. The array of claim 3 , wherein the tapered sidewalls have a linear taper.
5. The array of claim 1 , wherein said first electrode comprises a plurality of interconnected electrodes.
6. The array of claim 5 , wherein said second electrode comprises a plurality of second electrodes arranged to permit addressing of said non-uniform cross-section microcavities.
7. The array of claim 1 , wherein the thin metal foils of the first and second electrodes comprise aluminum and the oxide of said first and second electrodes comprises aluminum oxide.
8. The array of claim 1 , wherein the thin metal foils of the first and second electrodes comprise titanium and the oxide of said first and second electrodes comprises titanium dioxide.
9. The array of claim 1 , wherein the packaging layer is one of a glass or polymer.
10. A method for forming an array of microcavity devices, comprising:
pre-anodizing a metal foil or thin film;
patterning photoresist onto the anodized metal foil or film to encapsulate the anodized foil or film except on a top surface at desired positions of microcavities;
conducting a second anodization or electrochemical etching to form the non-uniform cross-section microcavities;
removing the photoresist and metal oxide;
conducting a final anodization so as to line the cavities with metal oxide and completely bury the metal electrodes in metal oxide.
11. The array of claim 1 , wherein the first electrode consists of the thin metal foil or film including a plurality of non-uniform cross-section microcavities therein and being encapsulated in oxide of the metal of the thin metal foil.