IP Library Granted Patent US 8,456,437
Granted Patent B2
US 8,456,437 · App. 12/720,980 · Granted Jun 4, 2013

Touch pad module assembly structure

Inventors: Tsung-Ju Chiang (Taoyuan Shien, TW); Hsiu-Pen Lin (Taoyuan County, TW)
Assignee: Quanta Computer Inc.
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Quick Facts
Patent No.
US 8,456,437
App. No.
12/720,980
Granted
Jun 4, 2013
Kind
B2
Abstract

A touch pad module assembly structure includes a housing, a touch pad module and a metal bracket. The housing includes a generally rectangular opening. The touch pad module is assembled into the opening. The touch pad module includes a support member and a circuit board. An edge of the support member has a through hole and a pair of resilient members. An opposite edge of the support member has a connection member secured to a surrounding surface of the opening. The circuit board is disposed over the support member and includes a switch aligned with the through hole. The metal bracket is secured to a surrounding edge of the opening to be in to contact with the switch and expose the connection member.

Claims (13)

1. A touch pad module assembly structure comprising:

a housing comprising a generally rectangular opening;

a touch pad module being assembled into the opening, the touch pad module comprising:

a support member, an edge of which has a through hole and a pair of resilient members, an opposite edge of which has a connection member secured to a surrounding surface of the opening; and

a circuit board disposed over the support member and comprising a switch aligned with the through hole; and

a metal bracket secured to a surrounding edge of the opening to be in contact with the switch and expose the connection member.

2. The touch pad module assembly structure of claim 1 , wherein the switch is disposed between the pair of resilient members.

3. The touch pad module assembly structure of claim 1 , wherein the housing is made from plastic materials.

4. The touch pad module assembly structure of claim 1 , wherein the touch pad module comprises a glass panel disposed over the circuit board.

5. The touch pad module assembly structure of claim 1 , wherein the circuit board comprises an electrical connector.

6. The touch pad module assembly structure of claim 5 , wherein the support member comprises a second through hole exposing the electrical connector.

7. The touch pad module assembly structure of claim 6 , wherein the metal bracket comprises a third through hole exposing the electrical connector.

8. The touch pad module assembly structure of claim 1 , wherein the support member is made from plastic materials.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2010
From: CHIANG, TSUNG-JU; LIN, HSIU-PEN
To: QUANTA COMPUTER INC.
Reel/Frame 024058/0660 →
Priority Claims (1)
TW 98218317 U · Oct 5, 2009 · national
Continuity (1)
Related Publication 20110080354A1 · Apr 7, 2011