Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method
A photosensitive resin composition comprising a (A) binder polymer, a (B) photopolymerizing compound having ethylenic unsaturated bonds in the molecule, a (C) photopolymerization initiator and a (D) polymerization inhibitor, wherein the (C) photopolymerization initiator comprises an acridine compound, and the content of the (D) polymerization inhibitor is 20-100 ppm by weight.
1. A photosensitive resin composition comprising a (A) binder polymer, a (B) photopolymerizing compound having ethylenic unsaturated bonds in the molecule, a (C) photopolymerization initiator and a (D) polymerization inhibitor,
wherein the (C) photopolymerization initiator comprises an acridine compound, and the content of the (D) polymerization inhibitor is 20-100 ppm by weight.
2. A photosensitive resin composition according to claim 1 , wherein the acridine compound includes a compound represented by the following formula (I):
wherein R 1 represents a C2-20 alkylene, oxadialkylene or thiodialkylene group.
3. A photosensitive resin composition according to claim 1 , wherein the (B) photopolymerizing compound having ethylenic unsaturated bonds in the molecule includes a compound represented by the following formula (II):
wherein R 2 and R 3 each independently represent hydrogen atom or a methyl group, X and Y each independently represent a C1-6 alkylene group, and m 1 , m 2 , n 1 and n 2 represent integers of 0-20 selected so that m 1 +m 2 +n 1 +n 2 =0-40.
4. A photosensitive resin composition according to claim 1 , wherein the (B) photopolymerizing compound having ethylenic unsaturated bonds in the molecule includes a compound represented by the following formula (III):
wherein R 4 represents hydrogen atom or a methyl group, R 5 represents hydrogen atom or a methyl or halogenated methyl group, R 6 represents C1-6 alkyl, a halogen atom or a hydroxyl group, k represents an integer of 0-4, and when k is 2 or greater, the multiple R 6 groups may be the same or different.
5. A photosensitive resin composition according to claim 1 , wherein the (D) polymerization inhibitor comprises a compound having a phenolic hydroxyl group.
6. A photosensitive element comprising a support and a photosensitive resin composition layer composed of a photosensitive resin composition according to claim 1 formed on the support.
7. A resist pattern manufacturing method that comprises:
a lamination step in which a photosensitive resin composition layer composed of a photosensitive resin composition according to claim 1 is laminated on a circuit-forming board,
an exposure step in which prescribed sections of the photosensitive resin composition layer are irradiated with active light rays for photocuring of the exposed sections, and
a developing step in which the sections other than the exposed sections of the photosensitive resin composition layer are removed from the circuit-forming board to form a resist pattern.
8. A resist pattern manufacturing method that comprises:
a lamination step in which the photosensitive resin composition layer of a photosensitive element according to claim 6 is laminated on a circuit-forming board,
an exposure step in which prescribed sections of the photosensitive resin composition layer are irradiated with active light rays for photocuring of the exposed sections, and
a developing step in which the sections other than the exposed sections of the photosensitive resin composition layer are removed from the circuit-forming board to form a resist pattern.
9. The resist pattern manufacturing method according to claim 7 , wherein the exposure step is a step in which the photosensitive resin composition layer is subjected to direct writing exposure with laser light for photocuring of the exposed sections.
10. A printed circuit board manufacturing method that comprises a step of etching or plating a circuit-forming board having a resist pattern formed by the manufacturing method according to claim 7 .
11. The resist pattern manufacturing method according to claim 8 , wherein the exposure step is a step in which the photosensitive resin composition layer is subjected to direct writing exposure with laser light for photocuring of the exposed sections.
12. A printed circuit board manufacturing method that comprises a step of etching or plating a circuit-forming board having a resist pattern formed by the manufacturing method according to claim 8 .