Semiconductor optical modulation device
A temperature control module and a support block are mounted on a metal stem. A dielectric substrate is mounted on a side surface of the support block. A support block is mounted on a cooling surface of the temperature control module. A dielectric substrate is mounted on a side surface of the support block. A semiconductor optical modulation element is mounted on the dielectric substrate. A lead pin and a signal line are connected through a bonding wire. The signal line and a signal conductor are connected through a bonding wire. The signal conductor and the semiconductor optical modulation element are connected through a bonding wire.
1. A semiconductor optical modulation device comprising:
a metal stem;
a lead pin that penetrates through the metal stem;
a first support block that is mounted on the metal stem;
a temperature control module that is mounted on the metal stem;
a first dielectric substrate that is mounted on a side surface of the first support block;
a second support block that is mounted on the temperature control module;
a signal line that is formed on the first dielectric substrate;
a second dielectric substrate that is mounted on a side surface of the second support block;
a signal conductor that is formed on the second dielectric substrate;
a semiconductor optical modulation element that is mounted on the second dielectric substrate;
a first bonding wire that connects the lead pin to an end of the signal line;
a second bonding wire that connects the other end of the signal line to an end of the signal conductor; and
a third bonding wire that connects another end of the signal conductor to the semiconductor optical modulation element.
2. The semiconductor optical modulation device according to claim 1 , wherein the first support block supports both ends of the first dielectric substrate.
3. The semiconductor optical modulation device according to claim 1 , further comprising a ground conductor that is formed on the first dielectric substrate with a constant distance to the signal line.
4. The semiconductor optical modulation device according to claim 3 , further comprising a resistor that is formed on the first dielectric substrate and connects the signal line to the ground line.
5. The semiconductor optical modulation device according to claim 1 , wherein the metal stem has a rectangular shape.
6. The semiconductor optical modulation device according to claim 1 , further comprising a heat radiation block that is attached to a back side of the metal stem.
7. A semiconductor optical modulation device comprising:
a metal stem;
a lead pin that penetrates through the metal stem;
a first dielectric substrate that is mounted on the metal stem via a side surface thereof;
a temperature control module that is mounted on the metal stem;
a support block that is mounted on the temperature control module;
a signal line that is formed on the first dielectric substrate;
a second dielectric substrate that is mounted on a side surface of the support block;
a signal conductor that is formed on the second dielectric substrate;
a semiconductor optical modulation element that is mounted on the second dielectric substrate;
a first bonding wire that connects the lead pin to an end of the signal line;
a second bonding wire that connects the other end of the signal line to an end of the signal conductor; and
a third bonding wire that connects another end of the signal conductor to the semiconductor optical modulation element.
8. The semiconductor optical modulation device according to claim 7 , further comprising a ground conductor that is formed on the first dielectric substrate with a constant distance to the signal line.
9. The semiconductor optical modulation device according to claim 8 , further comprising a resistor that is formed on the first dielectric substrate and connects the signal line to the ground line.
10. The semiconductor optical modulation device according to claim 7 , wherein the metal stem has a rectangular shape.
11. The semiconductor optical modulation device according to claim 7 , further comprising a heat radiation block that is attached to a back side of the metal stem.