Circuit for detection of failed solder-joints on array packages

1. A circuit for detecting changes in resistance at a solder joint connecting a constant voltage source supplying a first voltage and a pin of an array package during operation of the array package, the circuit comprising:

a test circuit for applying a second voltage different from the first voltage at a side of the solder joint opposite the constant voltage source; and

a monitoring circuit for monitoring an output of the test circuit,

wherein the test circuit is configured to output the first voltage when the resistance at the solder joint is below a threshold value, and to output a voltage other than the first voltage when the resistance at the solder joint is above the threshold value, and

wherein the monitoring circuit is configured to indicate a failure of the solder joint connection when the voltage other than the first voltage is output by the test circuit.

2. The circuit of claim 1 , wherein the monitoring circuit is configured to perform a logic level change to indicate the failure of the solder joint connection when the voltage other than the first voltage is output by the test circuit, and wherein the voltage other than the first voltage is any voltage above a first threshold voltage that is greater than the first voltage or any voltage below a second threshold voltage that is less than the first voltage.

3. The circuit of claim 1 , wherein the pin is located near a corner of the array package.

4. The circuit of claim 1 , wherein the pin comprises an input-output block of the array package comprising the test circuit.

5. The circuit of claim 4 , wherein the first voltage is ground and the test circuit comprises a pull-up resistor connecting the second voltage to the pin, and wherein when the resistance at the solder joint is at the threshold value, the resistance at the solder joint is at a first ratio with respect to a resistance of the pull-up resistor, and the output of the test circuit is configured to change from ground to the voltage other than the first voltage when the resistance at the solder joint is greater than the threshold value.

6. The circuit of claim 4 , wherein the first voltage is ground, the test circuit comprises a test pulse output driver, and the second voltage is supplied as a periodic test pulse, and wherein when the resistance at the solder joint is above the threshold value, the test pulse is configured to change the output of the test circuit from ground to the voltage other than the first voltage.

7. The circuit of claim 6 , wherein the test pulse output driver comprises a circuit for limiting a duty cycle of the test pulse to reduce stress on the test pulse output driver.

8. The circuit of claim 7 , wherein the test pulse output driver comprises:

an asynchronous delay for delaying a clock signal;

an inverter for inverting the delayed clock signal;

a NAND gate for receiving the clock signal and the delayed inverted clock signal; and

a tri-state controller for outputting the test pulse corresponding to an output from the NAND gate.

9. The circuit of claim 7 , wherein the test circuit further comprises an additional pull-up resistor connecting a constant voltage source at the second voltage to the pin.

10. The circuit of claim 7 , wherein a duration of the test pulse is about 3 nanoseconds.

11. The circuit of claim 1 , wherein the pin is a first pin configured to supply the first voltage to the array package, and wherein a second pin connected to the first pin comprises an input-output block of the array package comprising the test circuit.

12. The circuit of claim 11 , wherein the first pin is located near a corner of the array package, and the second pin is located farther from the corner than the first pin.

13. The circuit of claim 11 , wherein the first pin comprises a ground pin coupled to a ground connection of the array package, and the test circuit comprises a pull-up resistor connecting the second voltage to the second pin, and wherein when the resistance at the solder joint is at the threshold value, the resistance at the solder joint is at a first ratio with respect to a resistance of the pull-up resistor, and the output of the test circuit is configured to change from ground to the voltage other than the first voltage when the resistance at the solder joint is greater than the threshold value.

14. The circuit of claim 13 , wherein the test circuit further comprises an additional pull-up resistor connecting the second voltage to a trace between the first pin and the second pin.

15. The circuit of claim 11 , wherein the first pin comprises a power pin coupled to a power connection of the array package, and the test circuit comprises a pull-down resistor connecting the second voltage to the second pin, and wherein when the resistance at the solder joint is at the threshold value, the resistance at the solder joint is at a first ratio with respect to a resistance of the pull-down resistor, and the output of the test circuit is configured to change from a voltage of the power connection to the voltage other than the first voltage when the resistance at the solder joint is greater than the threshold value.

16. The circuit of claim 15 , wherein the pull-down resistor connects the second voltage to the second pin via a trace between the first pin and the second pin.