Systems and methods for vertically stacking a sensor on an integrated circuit chip
A sensing unit package with reduced size and improved thermal sensing capabilities. An exemplary package includes a printed circuit board with a plurality of electrical traces, an application-specific integrated circuit (Analog ASIC) chip, and a micromachined sensor formed on a microelectromechanical system (MEMS) die. The Analog ASIC chip is electrically and mechanically attached to the printed circuit board. The MEMS die is in direct electrical communication with only a portion of the electrical traces of the printed circuit board and is mechanically and thermally attached directly to the Analog ASIC chip. A thermally conducting compound is located between the MEMS die and the Analog ASIC chip. One or more solder balls electrically attach the Analog ASIC chip to the printed circuit board and one or more solder traces electrically attach the MEMS die to the printed circuit board.
1. A sensing unit comprising:
a printed circuit board comprising a plurality of electrical traces;
an application-specific integrated circuit (ASIC) chip being electrically and mechanically attached to the printed circuit board;
a micromachined sensor formed on a microelectromechanical system (MEMS) die being in direct electrical communication with only a portion of the electrical traces of the printed circuit board and being mechanically and thermally attached directly to the ASIC chip;
a nonelectrical epoxy connected to the ASIC chip and the printed circuit board;
one or more solder balls, wherein the ASIC chip is electrically attached to the printed circuit board using the one or more solder balls, wherein the nonelectrical epoxy surrounds the solder balls; and
one or more solder traces configured to electrically attach a lead on a surface of the MEMS die to the printed circuit board, wherein the surface of the MEMS die faces the ASIC chip and the printed circuit board.
2. The unit of claim 1 , wherein the sensor comprises at least one of an accelerometer or an angular rate sensor.
3. The unit of claim 1 , wherein the MEMS die is a leadless chip carrier (LCC) package.
4. The unit of claim 1 , wherein the MEMS die is a wafer-level chip-scale package (WLCSP).
5. The unit of claim 1 , further comprising a thermally conducting compound located between the MEMS die and the ASIC chip.
6. The unit of claim 5 , wherein the thermally conducting compound is at least one of an adhesive compound or an epoxy.
7. A method comprising:
electrically and mechanically attaching an application-specific integrated circuit (ASIC) chip directly to a printed circuit board using solder balls surrounded by non-conductive epoxy;
only mechanically and thermally attaching a micromachined sensor formed on a microelectromechanical system (MEMS) die to the ASIC chip; and
electrically attaching the sensor directly with only a portion of electrical traces located on the printed circuit board using one or more solder traces extending from a side of the MEMS die closest to the ASIC chip and the printed circuit board,
wherein attaching the ASIC chip comprises injecting the non-conductive epoxy after the ASIC chip is attached to the printed circuit board.