Semiconductor memory device and method for manufacturing the same
According to one embodiment, a semiconductor memory device includes a multilayer body, a second electrode film provided on the multilayer body, a second insulating film provided on the second electrode film, a semiconductor film, a memory film and a gate insulating film. At boundary between the inner surface of the second through hole and the inner surface of the third through hole, or on the inner surface of the second through hole, a step difference is formed so that an upper side from the step difference is thicker than a lower side from the step difference.
1. A semiconductor memory device comprising:
a multilayer body with a plurality of first insulating films and first electrode films alternately stacked, the multilayer body including a first through hole extending in stacking direction of the first insulating films and the first electrode films;
a second electrode film provided on the multilayer body and including a second through hole, the second through hole extending in the stacking direction and being coupled with the first through hole;
a second insulating film provided on the second electrode film and including a third through hole, the third through hole extending in the stacking direction and being coupled with the second through hole;
a semiconductor film provided on inner surfaces of the first to third through hole;
a memory film provided between the first electrode films and the semiconductor film; and
a gate insulating film provided between the second electrode film and the semiconductor film,
at boundary between the inner surface of the second through hole and the inner surface of the third through hole, a step difference being formed so that the third through hole is thicker than the second through hole in a lateral direction perpendicular to the stacking direction.
2. The device according to claim 1 , wherein impurity concentration in a portion of the semiconductor film covering the step difference is higher than impurity concentration in a portion except the portion of the semiconductor film covering the step difference.
3. The device according to claim 1 , wherein lamination of layers of the memory film is identical to lamination of layers of the gate insulating film.
4. A semiconductor memory device comprising:
a multilayer body with a plurality of first insulating films and first electrode films alternately stacked, the multilayer body including a first through hole extending in stacking direction of the first insulating films and the first electrode films;
a second electrode film provided on the multilayer body and including a second through hole, the second through hole extending in the stacking direction and being coupled with the first through hole;
a second insulating film provided on the second electrode film and including a third through hole, the third through hole extending in the stacking direction and being coupled with the second through hole;
a semiconductor film provided on inner surfaces of the first to third through hole;
a memory film provided between the first electrode films and the semiconductor film; and
a gate insulating film provided between the second electrode film and the semiconductor film,
on the inner surface of the second through hole, a step difference being formed so that an upper side of the second through hole is thicker than a lower side of the second through hole in a lateral direction perpendicular to the stacking direction.
5. The device according to claim 4 , wherein impurity concentration in a portion of the semiconductor film covering the step difference is higher than impurity concentration in a portion except the portion of the semiconductor film covering the step difference.
6. The device according to claim 4 , wherein lamination of layers of the memory film is identical to film configuration lamination of layers of the gate insulating film.