Locking device and method for making the same

1. A locking device providing thermal management for an electrical assembly board comprising:

a fluid-permeable member saturated with a fluid and disposed between the electrical assembly board and a heat sink;

a pair of locking device substrates substantially orthogonal to the electrical assembly board and the heat sink, wherein the fluid-permeable member is disposed between the locking device substrates; and

an actuator coupled to at least one of the locking device substrates;

wherein the actuator is configured to compress the fluid-permeable member by at least one of the locking device substrates forcing a portion of the fluid out of the fluid-permeable member and forming at least one fluid contact interface with the electrical assembly board and the heat sink in a reversible process.

2. The locking device of claim 1 , further comprising at least one spacer between the locking device substrates and disposed within the fluid-permeable member wherein the spacer provides for one or more fluid-permeable segments.

3. The locking device of claim 2 , wherein the spacer comprises a pair of spacer substrates substantially parallel and in close proximity with a flexible member disposed on either end of the spacer thereby joining the spacer substrates.

4. The locking device of claim 3 , wherein the spacer substrates are coupled to the actuator such that the spacer substrates are moved apart by the actuator and the flexible member is compressed between the spacer substrates.

5. The locking device of claim 1 , wherein the fluid-permeable member comprises a plurality of metal wires forming pores for fluid, and wherein at least some of the metal wires include a passivation layer.

6. The locking device of claim 5 , wherein the metal wires comprises at least one of copper (Cu), gold (Au), titanium (Ti), silver (Ag), nickel (Ni), platinum (Pt), palladium (Pd) and compositions thereof.

7. The locking device of claim 6 , wherein the metal wires comprises one of a hollow core and a polymeric core.

8. The locking device of claim 1 , wherein the fluid-permeable member comprises a plurality of sintered particles or a polymer foam.

9. The locking device of claim 8 , wherein the fluid comprises liquid metal which comprises at least one of gallium, indium, tin, indalloy, galinstant and compositions thereof.

10. The locking device of claim 1 , further comprising a fluid retaining wall for preventing fluid seepage.

11. An electrical assembly, comprising:

an electrical circuit board generating heat;

a heat sink; and

a locking device interposed between the electrical circuit board and the heat sink and comprising:

a plurality of contact interfaces, wherein at least one of the contact interfaces is a fluid-permeable member saturated with a fluid;

a pair of locking device substrates substantially orthogonal to the electrical circuit board and the heat sink; and

an actuator coupled to at least one of the locking device substrates wherein the fluid is squeezed out of the fluid-permeable member when compressed by the actuator to form at least one fluid contact interface with the electrical assembly board and the heat sink in a reversible process.

12. The electrical assembly of claim 11 , wherein the locking device further comprises at least one fluid retaining wall for preventing fluid seepage.

13. The electrical assembly of claim 11 , wherein the fluid-permeable member comprises at least one micro- or nano-structured metal sponge saturated with a liquid metal.

14. The electrical assembly of claim 11 , wherein the locking device comprises a plurality of wedge portions coupled to each other.

15. The electrical assembly of claim 14 , wherein the wedge portions comprises at least one metal sponge.