Sensor system, method for operating a sensor system, and method for manufacturing a sensor system

1. A pressure sensor system, comprising:

a substrate having at least one trench on a first side of the substrate, the trench being configured to form a first diaphragm region on a second side of the substrate opposite the first side;

wherein a second diaphragm region and a cavern are integrated within the first diaphragm region.

2. The sensor system as recited in claim 1 , wherein the second diaphragm region and the cavern form an absolute pressure sensor, and wherein the first diaphragm region and the at least one trench form a differential pressure sensor.

3. The sensor system as recited in claim 2 , wherein the first diaphragm region is configured such that deformation of the first diaphragm region generates a first voltage signal, and wherein the second diaphragm region is configured such that the deformation of the second diaphragm region generates a second voltage signal, the first voltage signal being generated as a function of a relative pressure difference between two pressures, and the second voltage signal being generated as a function of an absolute pressure.

4. The sensor system as recited in claim 3 , further comprising:

an evaluation circuit configured to generate a signal as a function of the difference between the first voltage signal and the second voltage signal.

5. The sensor system as recited in claim 3 , further comprising:

a reinforcing element attached to the middle of the first diaphragm region and extending in the middle of the at least one trench, wherein the reinforcing element has (i) a thickness extending perpendicular to the main plane of extension and toward the first side, and (ii) a lateral width extending parallel to the main plane of extension.

6. The sensor system as recited in claim 5 , further comprising:

a measuring element in the form of a piezoresistive element situated in the region of at least one of the first diaphragm region and the second diaphragm region.

7. The sensor system as recited in claim 1 , wherein the cavern is completely enclosed by the first diaphragm region.

8. A method for operating a sensor system including a substrate having at least one trench on a first side of the substrate, the trench being configured to form a first diaphragm region on a second side of the substrate opposite the first side, wherein a second diaphragm region and a cavern are integrated within the first diaphragm region, the method comprising:

measuring a first pressure in the at least one trench relative to a second pressure on the second side as a function of a first deformation of the first diaphragm region; and

measuring the second pressure relative to a third pressure in the cavern as a function of a second deformation of the second diaphragm region.

9. The method as recited in claim 8 , wherein the first deformation is measured with the aid of at least one first piezoresistive element generating a first voltage signal as a function of the first deformation, and wherein the second deformation is measured with the aid of at least one second piezoresistive element generating a second voltage signal as a function of the second deformation, and wherein the difference between the first voltage signal and the second voltage signal is determined.

10. The method as recited in claim 8 , wherein the cavern is completely enclosed by the first diaphragm region.

11. A method for manufacturing a sensor system, comprising:

providing, in a first step, a substrate, the substrate having a first side and a second side opposite one another;

providing, in a second step, a cavern within the substrate near the second side; and

providing, in a third step, at least one trench on the first side of the substrate, the trench being configured to form a first diaphragm region on the second side of the substrate;

wherein a second diaphragm region and the cavern are integrated within the first diaphragm region.

12. The method as recited in claim 11 , further comprising:

providing, in a fourth step between the second step and the third step, at least one of a measuring element and an evaluation circuit situated in the region of the second side.

13. The method as recited in claim 12 , wherein the second step includes a first substep and a second substep, a porous layer being formed in the substrate in the first substep, and an etching process being used to produce a cavern in the porous layer in the second substep, and wherein the second step is carried out from the second side.

14. The method as recited in claim 11 , wherein in the third step the trench is produced using a trench etching process from the second side.

15. The method as recited in claim 11 , wherein the cavern is completely enclosed by the first diaphragm region.