Electrostatic discharge protection device and applications thereof
An electrostatic discharge protection device comprises a substrate with a first conductivity, a gate, a drain structure and a source structure. The gate is disposed on a surface of the substrate. The drain structure with a second conductivity type comprises a first doping region with a first doping concentration disposed adjacent to the gate and extending into the substrate from the surface of the substrate, a second doping region extending into and stooped at the first doping region from the surface of the substrate and having a second doping concentration substantially greater than the first doping concentration, and a third doping region disposed in the substrate beneath the second doping region and having a third doping concentration substantially greater than the first doping concentration. The source structure with the second conductivity is disposed in the substrate and adjacent to the gate electrode.
1. An electrostatic discharge (ESD) protection device comprising:
a substrate, with a first conductivity type;
a gate, disposed on a surface of the substrate;
a drain structure having a second conductivity type and comprising:
a first doping region with a first doping concentration, disposed adjacent to the gate and extending into the substrate from the surface of the substrate;
a second doping region, extending into and stopped at the first doping region from the surface of the substrate and having a second doping concentration substantially greater than the first doping concentration; and
a third doping region, disposed in the substrate beneath the second doping region and having a third doping concentration substantially greater than the first doping concentration, the second doping concentration is substantially less than or equal to the third doping concentration; and
a source structure having the second conductivity type and disposed in the substrate adjacent to the gate.
2. The ESD protection device of claim 1 , further comprising a first shallow trench isolator (STI) disposed in the first doping region used to isolate the second doping region from the gate.
3. The ESD protection device of claim 1 , is a double-diffused-drain metal-oxide-semiconductor field-effect-transistor (D-D-D MOSFET) or a Field-Drift metal-oxide-semiconductor field-effect-transistor (F-D MOSFET).
4. The ESD protection device of claim 1 , wherein the source structure comprises:
a fourth doping region with the first doping concentration, disposed adjacent to the gate and extending into the substrate from the surface of the substrate; and
a fifth doping region with the second doping concentration, extending into the fourth doping region from the surface of the substrate.
5. The ESD protection device of claim 4 , further comprising a second STI disposed in the fourth doping region used to isolate the fifth doping region from the gate.
6. The ESD protection device of claim 1 , wherein the third doping region has a third lateral dimension with a direction perpendicular to the gate substantially less than a first lateral dimension of the first doping region and substantially greater than a second dimension of the second doping region.
7. An ESD protection circuit for protecting an internal IC from an ESD stress, comprising:
an elementary metal-oxide-semiconductor (MOS) transistor electrically connected to the internal circuit comprising:
a substrate with a first conductivity type;
a gate, disposed on a surface of the substrate;
a drain structure having a second conductivity type and comprising:
a first doping region, disposed adjacent to the gate and extending into the substrate from the surface of the substrate with a first doping concentration;
a second doping region, extending into the first doping region from the surface of the substrate with a second doping concentration substantially greater than the first doping concentration; and
a third doping region, disposed in the substrate and beneath the second doping region with a third doping concentration substantially greater than the first doping concentration, the second doping concentration is substantially less than or equal to the third doping concentration; and
a source structure having the second conductivity type and disposed in the substrate adjacent to the gate.
8. The ESD protection circuit of claim 7 , wherein the internal circuit is a power supply circuit or an input/output (I/O) circuit.
9. The ESD protection circuit of claim 7 , further comprising a first STI disposed in the first doping region used to isolate the second doping region from the gate.
10. The ESD protection circuit of claim 7 , wherein the elementary MOS transistor is a D-D-D MOS FET or an F-D MOSFET.
11. The ESD protection circuit of claim 7 , wherein the source structure comprises:
a fourth doping region, disposed adjacent to the gate and extending into the substrate from the surface of the substrate with the first doping concentration; and
a fifth doping region, extending into the fourth doping region from the surface of the substrate with the second doping concentration.
12. The ESD protection circuit of claim 11 , further comprising a second STI disposed in the fourth doping region used to isolate the fifth doping region from the gate.
13. The ESD protection circuit of claim 7 , wherein the third doping region has a third lateral dimension with a direction perpendicular to the gate substantially less than a first lateral dimension of the first doping region and substantially greater than a second dimension of the second doping region.
14. The ESD protection circuit of claim 7 , wherein the elementary MOS transistor is a GGNMOS FET, the gate and the source structure are grounded and the drain structure is electrically connected to a VDD power line or a bonding pad.
15. The ESD protection circuit of claim 7 , wherein the elementary MOS transistor is a gate-VDD p-type metal-oxide-semiconductor field-effect-transistor (GDPMOS FET), the gate and the source structure are electrically connected to a VDD power line and the drain structure is electrically connected to a VSS power line or a bonding pad.