Inspection device
An inspection device for inspecting a surface of an inspection object using a beam includes a beam generator capable of generating one of either charge particles or an electromagnetic wave as a beam, a primary optical system capable of guiding and irradiating the beam to the inspection object supported within a working chamber, a secondary optical system capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture, an image processing system capable of forming an image based on the secondary charge particles detected by the first detector; and a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object.
1. An inspection device for inspecting a surface of an inspection object using a beam comprising:
a beam generator which is capable of generating one of either charge particles or an electromagnetic wave as a beam;
a primary optical system which is capable of guiding and irradiating the beam to the inspection object supported within a working chamber;
a secondary optical system which is capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture;
an image processing system which is capable of forming an image based on the secondary charge particles detected by the first detector; and
a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object.
2. The inspection device according to claim 1 , wherein the first detector detects the secondary charge particles in a state where the location of the first movable numerical aperture is adjusted based on a detection result of the second detector.
3. The inspection device according to claim 1 wherein the beam is a beam of charged particles, the beam generator further comprising:
a photoelectron element formed by coating a photoelectron material on a planar part of a base material comprised from a transmittance part including the planar part, the photoelectron element receiving light irradiated from the photoelectron material to generate photoelectrons;
one or more lenses each arranged at a predetermined intervals after the photoelectron element respectively, the one or more lenses accelerating photoelectrons generated from the photoelectron element;
a second numerical aperture arranged on the lower side of the one or more lenses; and
a cathode lens arranged on the lower side of the numerical aperture.
4. The inspection device according to claim 1 wherein the beam is an electromagnetic wave beam, the beam generator generating a plurality of beams with different wavelengths.
5. The inspection device according to claim 1 wherein the first detector detects the secondary charge particles generated from a surface of the inspection object irradiated with the beam.
6. The inspection device according to claim 1 wherein the first detector detects the secondary charge particles generated from a surface opposite a surface of the inspection object irradiated with the beam.
7. The inspection device according to claim 1 wherein the first detector includes a TDI.
8. The inspection device according to claim 1 wherein the second detector includes an EB-CDD.
9. The inspection device according to claim 1 wherein the first movable numerical aperture includes an open part formed by a plus shape or slit.
10. The inspection device according to claim 1 further comprising:
an optical microscope and a SEM (scanning type electron microscope) which observes the inspection object;
wherein
the beam generator, the primary optical system, the secondary optical system, the image processing system, the optical microscope and the SEM are arranged in the working chamber.