System for separating a diced semiconductor die from a die attach tape
View Patent ↗A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.
1. A tool for separating a semiconductor die from at least one layer of a tape having first and second layers, the first and second layers held together with a peeling strength, the tool comprising:
a plurality of ejector pins;
a support table including an upper surface for supporting the tape and semiconductor die, the support table further including an aperture in the upper surface through which aperture the plurality of ejector pins extend, the aperture having at least one chamfered sidewall, the at least one chamfered sidewall provided so that a distance between the at least one chamfered sidewall and a wall opposite the at least one chamfered sidewall is greater at the upper surface of the support table as compared to a same dimension at a lower surface of the support table opposite the upper surface; and
a vacuum source for holding the first layer of the tape to the support table, the vacuum source being communicated to the aperture and exerting a force on the first layer of the tape exceeding the peeling strength.
2. The tool recited in claim 1 , the aperture being rectangular and including four chamfered sidewalls.
3. The tool recited in claim 1 , the aperture being rectangular and including two chamfered sidewalls opposite each other.
4. The tool recited in claim 1 , the at least one chamfered sidewall having a sidewall sloped at an angle of between 10° and 60° relative to the upper surface of the support table.
5. The tool recited in claim 1 , the at least one chamfered sidewall defining a space into which the first layer may be sucked away from at least one edge of the semiconductor die.
6. The tool recited in claim 1 , further comprising at least one ejector for extending through the aperture from the lower surface of the support table, the ejector capable of lifting the semiconductor die upward after the first layer has been sucked away from at least one edge of the semiconductor die.
7. The tool recited in claim 1 , wherein the aperture is rectangular and sized to have a length and width at the upper surface that is greater than a length and width of the semiconductor die, and wherein the aperture is sized to have a length and width at the lower surface that is less than the length and width of the semiconductor die.
8. The tool recited in claim 7 , wherein the first layer of the tape is sucked away from at least one edge of the semiconductor die and against the at least one chamfered sidewall upon activation of the vacuum source.
9. A tool for separating a semiconductor die from at least one layer of a tape, the tape having an adhesive having a peeling strength, the tool comprising:
a plurality of ejector pins together having a length and width defining a footprint of the ejector pins;
a support table including an upper surface for supporting the tape and semiconductor die, the support table further including an aperture in the upper surface, the aperture being at least as large as the footprint of the ejector pins, and the aperture having at least one chamfered sidewall; and
a vacuum source for holding the tape to the support table, the vacuum source being communicated to the aperture and exerting a force on the tape exceeding the peeling strength of the adhesive.
10. The tool recited in claim 9 , the aperture being rectangular and including four chamfered sidewalls.
11. The tool recited in claim 9 , the aperture being rectangular and including two chamfered sidewalls opposite each other.
12. The tool recited in claim 9 , the at least one chamfered sidewall having a sidewall sloped at an angle of between 10° and 60° relative to the upper surface of the support table.
13. The tool recited in claim 9 , the at least one chamfered sidewall defining a space into which the tape may be sucked away from at least one edge of the semiconductor die.
14. The tool recited in claim 9 , further comprising at least one ejector for extending through the aperture from the lower surface of the support table, the ejector capable of lifting the semiconductor die upward after the first layer has been sucked away from at least one edge of the semiconductor die.
15. The tool recited in claim 9 , wherein the aperture is rectangular and sized to have a length and width at the upper surface that is greater than a length and width of the semiconductor die, and wherein the aperture is sized to have a length and width at the lower surface that is less than the length and width of the semiconductor die.
16. The tool recited in claim 15 , wherein the tape is sucked away from at least one edge of the semiconductor die and against the at least one chamfered sidewall upon activation of the vacuum source.
17. A tool for separating a semiconductor die from at least one layer of a tape, the tape having an adhesive having a peeling strength, the tool comprising:
a plurality of ejector pins for lifting the semiconductor die upward;
a support table including an upper surface for supporting the tape and semiconductor die, the support table further including a rectangular aperture in the upper surface sized to receive all of the plurality of ejector pins therethrough, and the aperture having at least one chamfered sidewall, the aperture sized to have a length and width at the upper surface that is greater than a length and width of the semiconductor die, and wherein the aperture is sized to have a length and width at the lower surface that is less than the length and width of the semiconductor die; and
a vacuum source for holding the tape to the support table, the vacuum source being communicated to the aperture and exerting a force on the tape exceeding the peeling strength of the adhesive.
18. The tool recited in claim 17 , wherein the tape is sucked away from at least one edge of the semiconductor die and against the at least one chamfered sidewall upon activation of the vacuum source.
19. The tool recited in claim 17 , wherein the aperture includes four chamfered sidewalls.
20. The tool recited in claim 17 , the at least one chamfered sidewall defining a space into which the tape may be sucked away from at least one edge of the semiconductor die.